Interlocking Dot Substrate Bonding for Magnetic Recording Heads

The patent applies preliminary action by forming interlocking dot structures on the substrates before the reflow process. These dots are precisely positioned and interlocked to establish alignment, then the solder is reflowed to create mechanical and electrical connections. The pre-established dot interlocking structure maintains alignment accuracy throughout the thermal reflow process, preventing the substrate shifting that occurs in conventional bonding methods.

The patent introduces an intermediary mechanism - the interlocking dot structures - that act as a physical mediator between the two substrates. These dots are formed on both substrates and interlock with each other, creating a mechanical constraint that prevents substrate movement during the reflow process. This intermediary structure maintains the alignment established by the alignment marks throughout the bonding process, ensuring post-bonding alignment accuracy is preserved.

The patent applies preliminary anti-action by creating the interlocking dot structure before thermal reflow to counteract the substrate movement that will occur during heating. The dot interlocking mechanism establishes a mechanical constraint that resists and prevents the thermal expansion and movement induced by the reflow heating process, thereby maintaining alignment accuracy despite the thermal energy input required for solder bonding.