Interlocking Printed Circuit Board Composite for Sensor Positioning
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Solution Overview
Problem
Existing printed circuit board assembly methods lack an efficient and stable connection mechanism that ensures precise positioning and secure attachment of sensor components during the assembly and encapsulation processes, particularly in applications like vehicle transmission control units.
Innovation Solution
A method involving a two-groove connection between printed circuit boards, where one board supports another, allowing for both positive and non-positive engagement, and subsequent plastic encapsulation, with additional latching mechanisms and positioning formations to maintain stability and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional connection methods are used for printed circuit boards, then the assembly process is simpler, but positioning accuracy and stability of sensor components deteriorate
Solution Approach 1:
The connection mechanism is segmented into multiple functional elements: grooves in the circuit boards for basic alignment, positioning formations for precise location, and latching mechanisms for secure attachment. This segmentation allows each element to perform a specific function, achieving high positioning accuracy while maintaining a systematic approach to the overall connection process
Solution Approach 2:
The grooves and positioning formations are pre-formed in the circuit boards before assembly. This preliminary action ensures that when the boards are brought together, the positioning accuracy is automatically achieved without requiring complex real-time adjustment mechanisms during the assembly process
2Reliability
If sensor components are attached directly to the main circuit board, then the assembly process is shorter, but stability and positioning accuracy during encapsulation deteriorate
Solution Approach 1:
A first circuit board is introduced as an intermediary carrier between the sensor components and the main circuit board. This intermediary board provides a stable mounting surface with specialized grooves and positioning formations that secure sensor components during encapsulation, while still enabling efficient assembly through the standardized connection mechanism
Solution Approach 2:
The first circuit board with sensor components is nested onto the main circuit board through the groove connection mechanism. This nesting arrangement allows the sensor assembly to be securely held in position during encapsulation while maintaining a compact overall structure, achieving both stability and assembly efficiency
3Stability of the object's composition
If latching mechanisms are added to secure circuit boards, then connection stability improves, but device complexity increases
Solution Approach 1:
The latching mechanism is designed to automatically engage when the first circuit board is inserted into the groove of the main circuit board. The latching elements self-activate through the insertion motion itself, providing secure connection stability without requiring additional actuators, motors, or complex control systems, thus minimizing the increase in device complexity
Data Source
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AI summary
The invention relates to a method for producing a printed circuit composite (V), wherein a first printed circuit board (1), in particular a sensor carrier printed circuit board, is interlockingly engaged with a second printed circuit board (2), in particular a support circuit board. The invention also relates to a printed circuit board composite (V).