Interlocking Server Cells for Scalable Airflow
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Solution Overview
Problem
Conventional multiple-processor server systems face challenges with overheating due to midplane or backplane interference with airflow and limited scalability, as they are difficult to expand beyond one-dimensional configurations and rely on structural support from racks.
Innovation Solution
A cell-based server system comprising interlocking server cells with mechanical and electrical coupling assemblies that form a self-supporting structure, allowing for scalable configurations in one, two, or three dimensions without the need for a midplane or backplane, enabling efficient airflow and reconfigurability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a midplane or backplane is used to interconnect server blades or sleds, then inter-node connectivity is enabled, but airflow is interrupted causing overheating risk
Solution Approach 1:
The system divides the server platform into independent modular nodes (server blades or sleds) that can be interconnected without requiring a continuous midplane structure. Each node is self-contained with its own connectivity interfaces, allowing airflow to pass through the rack without obstruction from a spanning backplane.
Solution Approach 2:
The invention removes the midplane or backplane component entirely from the system architecture. Instead of using a central interconnection substrate, nodes communicate through direct peer-to-peer connections via network interfaces, eliminating the airflow-blocking structure while maintaining connectivity.
2Reliability
If a midplane or backplane is used for inter-node connection, then connectivity is provided, but the number of supported nodes is limited by midplane connectivity availability
Solution Approach 1:
Each server node is equipped with universal connectivity interfaces that can directly communicate with any other node in the system. This peer-to-peer architecture allows any node to connect with any other node without being constrained by a fixed midplane topology, enabling flexible scaling to accommodate varying numbers of nodes.
Solution Approach 2:
The system transitions from a two-dimensional midplane-based connectivity model to a three-dimensional mesh network where nodes can connect in multiple directions and planes. This allows nodes to be arranged in complex spatial configurations without being limited by a single planar interconnection substrate.
3Strength
If rack structural support is used for blade server or rack server configuration, then system structure is provided, but scalability is limited to one dimension and rack dimensions
Solution Approach 1:
The system decomposes the server platform into independent modular nodes that can be freely assembled and reconfigured. Each node is a self-contained unit that can be positioned independently within the rack, allowing the system to scale in multiple dimensions rather than being constrained to a single linear arrangement.
Solution Approach 2:
The rack-mounted node configuration enables dynamic reconfiguration of the system architecture. Nodes can be added, removed, or repositioned in three-dimensional space without requiring structural modifications to the rack itself, providing flexible scalability beyond fixed one-dimensional expansions.
Data Source
AI summary
A server system includes an array of server cells. Some or all of the server cells include a set of at least three side panels forming an enclosure and a compute component comprising a processor core. At least one side panel of each server cell is removably mechanically coupled and removably electrically coupled to a facing side panel of an adjacent server cell. The enclosure may form a triangular prism enclosure, a cuboid enclosure, a hexagonal prism enclosure, etc. The enclosure can be formed from a rigid flex printed circuit board (PCB) assembly, whereby the side panels are implemented as rigid PCB sections that are interconnected via flexible PCB sections, with the flexible PCB sections forming corners between the rigid PCB sections when the rigid-flex PCB assembly is folded into the enclosure shape. The compute component and other circuit components are disposed at the interior surfaces of the rigid PCB sections.