Interlocking Shiplap Foam Insulation Boards

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Solution Overview

Problem

Conventional foam insulation board installations in permafrost regions require two layers to mitigate thermal breaks, leading to increased material, labor, and time costs due to the need for additional boards to cover edge gaps.

Innovation Solution

Rigid foam insulation boards with interlocking shiplap edges, allowing adjacent boards to overlap and form a flush joint, reducing the need for multiple layers by preventing thermal breaks and minimizing the requirement for additional fasteners.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional foam boards are installed with simple edges, then installation is simple and quick, but thermal breaks occur at the edges requiring additional layers of boards

Engineering Contradiction:
Improvethermal integrityVSAvoidinstallation efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The edge of the foam board is segmented into distinct geometric features (recess and protrusion) that create an interlocking shiplap joint. This segmentation allows the edge to serve multiple functions: maintaining thermal integrity through the recess-protrusion interface and enabling quick installation through the predetermined geometry that guides alignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The shiplap features (recess and protrusion) are pre-formed on the foam boards during manufacturing. This preliminary action eliminates the need for field preparation or additional fastening steps, allowing workers to simply place the boards together and achieve both thermal integrity and installation efficiency.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If two layers of foam boards are used to prevent thermal breaks, then thermal integrity is improved, but material cost and installation time increase

Engineering Contradiction:
Improvethermal integrityVSAvoidmaterial quantity
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The solution moves from a vertical stacking approach (two layers) to a horizontal interlocking approach (single layer with shiplap edges). By developing the joint geometry in the horizontal plane rather than requiring vertical layering, the patent achieves thermal integrity without increasing material quantity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent merges the functions of thermal insulation and edge sealing into a single layer of foam board with integrated shiplap features. This consolidation eliminates the need for separate layers dedicated to preventing thermal breaks, reducing overall material quantity while maintaining thermal integrity.

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If foam boards are installed without interlocking edges, then installation is faster, but board displacement occurs requiring additional fasteners

Engineering Contradiction:
Improveinstallation speedVSAvoidboard stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The shiplap features enable the foam boards to self-align and self-lock during installation. The protrusion fits into the recess, automatically positioning adjacent boards correctly and preventing displacement without requiring external fasteners. This self-service mechanism maintains board stability while preserving installation speed.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The recess-protrusion interface acts as an intermediary mechanical element between adjacent foam boards. This intermediate feature facilitates the connection by providing a predetermined path for alignment and a positive locking mechanism, eliminating the need for additional fasteners while ensuring board stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11952779B2Insulation boards with interlocking shiplap edges
Publication Date: 2024.04.09 OWENS CORNING INTELLECTUAL CAPITAL LLC
  • US11952779B2 patent drawing
  • US11952779B2 patent drawing
  • US11952779B2 patent drawing

AI summary

Foam insulation boards having an improved shiplap edge for interfacing with one another are disclosed.