Intermediate Board Terminal Module for Shorter Signal Paths
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Solution Overview
Problem
Existing electrical connectors for optoelectronic transceiver modules result in long signal transmission paths, reduced transmission efficiency, and difficulty in maintenance due to the use of connecting wires and connectors, and the manufacturing process is labor-intensive and time-consuming.
Innovation Solution
A terminal module manufacturing method using stamping processes to form terminals with high precision and adjust their number, followed by a plastic molding process to create a terminal base, allowing for a compact, high-density arrangement and direct connection to a motherboard via a pressure connection mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If connecting wires and connectors are used to connect optoelectronic transceiver module to motherboard, then connection is achieved, but signal transmission path becomes long and transmission efficiency decreases
Solution Approach 1:
The patent merges the optoelectronic transceiver module directly with the motherboard by integrating terminals onto the motherboard surface, eliminating the need for separate connecting wires and connectors. This direct integration shortens the signal transmission path and improves transmission efficiency while maintaining reliable electrical connection.
2Ease of manufacture
If etching process is used to manufacture terminals, then terminals can be formed, but manufacturing complexity increases and production time extends to 4-6 months
Solution Approach 1:
The patent replaces the chemical etching process with a mechanical stamping process to form terminals. The stamping process uses metal stamps to directly press and form terminals from metal foil on the motherboard, eliminating multiple chemical processing steps (metal etching, degreasing, water washing, etching, and drying) and reducing production time from 4-6 months to a much shorter duration.
3Adaptability or versatility
If etching process is used for terminal manufacturing, then terminals are formed, but number of terminals cannot be easily adjusted and design difficulty increases
Solution Approach 1:
The patent introduces flexibility in terminal configuration by allowing the number, position, and layout of terminals to be dynamically adjusted according to design requirements. The stamping process enables custom terminal arrangements without being constrained by fixed photomask patterns, making the manufacturing process adaptable to different terminal configurations and reducing design difficulty.
4Ease of manufacture
If printed circuit board and etched terminals are bonded together, then stacked structure is formed, but labor intensity increases and production becomes time-consuming
Solution Approach 1:
The patent merges the terminal formation process with the motherboard manufacturing process by directly stamping terminals onto the metal foil layer of the printed circuit board during the same production run. This eliminates the separate bonding step required in traditional processes where etched terminals must be bonded to the printed circuit board, reducing labor intensity and increasing production speed.
Data Source
AI summary
An electrical connector structure, a terminal module and a terminal module manufacturing method are disclosed. The electrical connector structure is configured to connect an optoelectronic transceiver module to a motherboard. The electrical connector structure includes an intermediate board module and a fixing structure. The terminal modules of the intermediate board module are arranged side by side. The terminal module includes a plurality of terminals and a terminal base. The terminal base covers the terminals. Each of the terminals includes a root portion, a first terminal arm and a second terminal arm. The root portion is covered by the terminal base, and an end portion of the first terminal arm and an end portion of the second terminal arm extend out of the terminal base.