Intermediate Component Thermal Offset for PCB Soldering
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Solution Overview
Problem
Electronic components on printed circuit boards face thermal stress during soldering, particularly when not positioned optimally, leading to potential degradation due to inadequate insulation, especially when placed on daughter boards perpendicular to the motherboard, which can result in excessive heating.
Innovation Solution
The use of intermediate electronic components positioned between the motherboard and superimposed components to create a thermal offset, ensuring air circulation and using thermally insulating materials to minimize heat transfer, thereby protecting sensitive components from excessive heat during welding operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are placed on a daughter board perpendicular to the motherboard to save space, then space utilization is improved, but thermal insulation deteriorates because the component cannot be positioned with its insulated face toward the heat source
Solution Approach 1:
The patent introduces an intermediate electronic component positioned between the sensitive component and the motherboard. This intermediary component serves as a thermal barrier, blocking heat transfer from the motherboard to the sensitive component while allowing the component to maintain its space-saving perpendicular placement on the daughter board.
Solution Approach 2:
The patent extracts the thermal insulation function from the component's own structure and assigns it to a separate intermediate component. This allows the sensitive component to focus on its primary function while the intermediate component handles thermal protection, resolving the conflict between space constraints and thermal insulation requirements.
2Object-affected harmful factors
If additional insulating films or wedges are placed between the component and motherboard to provide thermal protection, then thermal insulation is improved, but manufacturing complexity increases due to additional manufacturing steps and components
Solution Approach 1:
The intermediate electronic component serves multiple functions simultaneously: it provides thermal insulation to protect sensitive components, acts as a structural element for mounting, and can be integrated into the existing component placement process. This multi-functionality eliminates the need for separate insulating films or wedges, simplifying the manufacturing process.
Solution Approach 2:
The patent merges the thermal insulation function with the structural support function by using an electronic component that serves both purposes. Instead of adding separate insulating elements, the intermediate component combines thermal barrier properties with mechanical support, reducing the total number of parts and manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal stress on sensitive components by maintaining a stable thermal environment, preventing degradation and allowing for efficient assembly without additional manufacturing steps or components, ensuring reliable operation of electronic devices.
Implementation Method 1
using thermally insulating materials to minimize heat transfer
Implementation Method 2
ensuring air circulation
Data Source
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AI summary
The device (1) has a motherboard (5) including a rear side (3) carrying welding tabs for welding electronic components (2), and a component side (4) opposite the rear side. The electronic components are superimposed in the component side of the motherboard such that an intermediate component (6) is located directly between the motherboard and a superimposed component (7) i.e. relay. The intermediate component is welded onto the motherboard, where the intermediate component includes an encapsulation made of plastic or thermally insulating material. Independent claims are also included for the following: (1) a home automation control module (2) a method for manufacturing the electronic device.