Intermediate Connection Member Layout for Fine-Pitch 3D Wiring
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Solution Overview
Problem
The demand for further miniaturization of electronic equipment has led to challenges in reducing the pitch of wiring in intermediate connection members used in three-dimensional mounting structures, as thinner insulating material between wiring holes becomes prone to peeling or deformation during hole boring.
Innovation Solution
A method for manufacturing an intermediate connection member involves forming grooves on insulating substrates, disposing conductive members within these grooves, and then aligning and bonding the substrates with an insulating layer in between, allowing for precise cutting to expose the ends of the wiring portions for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pitch between through holes is reduced to achieve further miniaturization, then the wiring density increases, but the insulating material between holes becomes thinner causing peeling or deformation during hole boring
Solution Approach 1:
The patent divides the formation of through holes into two separate stages: first forming grooves in the insulating substrate, then inserting conductive members into these grooves. This segmentation allows the groove formation to be done with standard precision while accommodating reduced pitch, as the groove walls provide structural support that prevents peeling and deformation during subsequent processing.
Solution Approach 2:
The patent performs preliminary action by forming grooves in the insulating substrate before inserting the conductive members. These pre-formed grooves provide structural reinforcement at the locations where through holes will eventually be created, preventing the insulating material from peeling or deforming when the reduced-pitch holes are bored later in the manufacturing process.
2Productivity
If mechanical drilling is used to create through holes, then the process is simple and fast, but reducing the pitch causes the thin insulating material to peel or deform
Solution Approach 1:
The patent segments the through hole formation process into groove formation followed by conductive member insertion. This allows mechanical drilling to be used for groove creation (maintaining productivity) while the groove structure itself provides the structural integrity needed to prevent peeling and deformation, even at reduced pitches.
Solution Approach 2:
The preliminary formation of grooves creates structural reinforcement before the actual through holes are drilled. This preliminary action ensures that when mechanical drilling occurs at reduced pitch, the insulating material has sufficient structural support to maintain its integrity and prevent peeling or deformation.
Data Source
AI summary
An intermediate connection member includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside, and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.