Intermediate Filtering Structure for Shorter Chip Power Paths
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Solution Overview
Problem
Conventional filtering architectures in power supply circuits have a long filtering path, leading to poor dynamic response capability and overall filtering performance, especially for high-current applications, due to the placement of capacitors which occupy a large layout area and limit the capacity of filtering components.
Innovation Solution
A filtering structure is introduced with an intermediate assembly between the chip and the circuit board, where a first filtering assembly is placed inside the intermediate assembly and at least part of a second filtering assembly is on the circuit board surface, reducing the filtering path and improving dynamic response by placing filtering components closer to the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If capacitors are arranged on the periphery of the chip and on the circuit board away from the chip, then the layout area is sufficient, but the filtering path becomes long and dynamic response capability deteriorates
Solution Approach 1:
The patent introduces an intermediate assembly that creates a new spatial dimension between the chip and circuit board. By placing filtering components in this intermediate space rather than only on the circuit board surface, the filtering path is shortened in the vertical dimension while maintaining adequate layout area on the circuit board.
Solution Approach 2:
The intermediate assembly acts as an intermediary structure between the chip and circuit board. It carries filtering components (capacitors, inductors) that are positioned closer to the chip, thereby mediating the connection and reducing the filtering path length without compromising the circuit board layout.
2Speed
If filtering components are placed closer to the chip, then the filtering path is shortened and dynamic response is improved, but the layout area on the circuit board is reduced
Solution Approach 1:
The intermediate assembly utilizes the vertical space between the chip and circuit board, transforming a two-dimensional layout problem into a three-dimensional spatial solution. This allows filtering components to be positioned closer to the chip without consuming additional circuit board layout area.
Solution Approach 2:
The filtering components are nested within or attached to the intermediate assembly structure, which itself is positioned between the chip and circuit board. This nesting approach consolidates the filtering function into a compact intermediate structure rather than spreading components across the circuit board surface.
3Device complexity
If a single filtering assembly is used on the circuit board, then the structure is simple, but the filtering performance is insufficient for high-current applications
Solution Approach 1:
The filtering function is segmented into two distinct assemblies: a first filtering assembly on the circuit board and a second filtering assembly on the intermediate assembly closer to the chip. This segmentation allows each assembly to be optimized for different frequency ranges and filtering requirements, improving overall filtering performance for high-current applications.
Solution Approach 2:
Different filtering components and configurations are applied at different locations: the first filtering assembly handles general filtering on the circuit board, while the second filtering assembly provides enhanced filtering closer to the chip. This local differentiation of filtering quality addresses the specific needs of high-current applications at different points in the power distribution network.
Data Source
AI summary
Embodiments of this application provide a filtering structure and an electronic device. In the filtering structure, an intermediate assembly is disposed between a chip and a circuit board, a first filtering assembly is disposed inside the intermediate assembly, and at least a part of a second filtering assembly is disposed on a surface that is of the circuit board and that is away from the intermediate assembly, so that the first filtering assembly is close to the chip. This shortens a filtering path of the chip, improves a dynamic response capability of the chip, and therefore improves an overall filtering capability.