Intermediate Layer for Flexible Display Substrate Thermal Stress
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Solution Overview
Problem
Flexible display devices face issues with microcracks and inorganic thin film detachment due to mismatched thermal expansion coefficients between plastic substrates and inorganic thin films during high-temperature manufacturing processes, affecting image quality and product yield.
Innovation Solution
Incorporating an intermediate layer with a thermal expansion coefficient between that of the organic base plate and the inorganic thin film, formed through chemical reactions using Si-containing materials, to alleviate thermal stress and prevent microcracks and film detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic thin film is formed on a plastic substrate to prevent solvent release during high-temperature manufacturing, then the semiconductor elements are protected from adverse effects, but the mismatched thermal expansion coefficients cause microcracks and film detachment
Solution Approach 1:
An intermediate layer is introduced between the plastic substrate and the inorganic thin film. This intermediate layer has a thermal expansion coefficient that is between that of the plastic substrate and the inorganic thin film, serving as a thermal expansion buffer that reduces the stress concentration at the interface and prevents microcrack formation and film detachment
Solution Approach 2:
The structure employs a composite material system consisting of the plastic substrate, intermediate layer, and inorganic thin film. The intermediate layer is formed by chemical vapor deposition of Si-containing materials, creating a composite structure that combines the flexibility of the plastic substrate with the protective properties of the inorganic thin film while mitigating thermal expansion mismatch through the intermediate layer
2Ease of manufacture
If a high-temperature manufacturing process is used to manufacture semiconductor elements on plastic substrate, then the semiconductor elements can be formed, but the plastic substrate deforms remarkably due to its low heat resistance
Solution Approach 1:
The thermal expansion coefficient parameter of the intermediate layer is specifically controlled to be between that of the plastic substrate and the inorganic thin film. This parameter optimization allows the intermediate layer to act as a thermal expansion buffer during high-temperature processing, reducing stress on both the substrate and thin film while maintaining substrate flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The intermediate layer effectively reduces thermal stress on the inorganic thin film, enhancing product yield and display quality by maintaining the flexibility and impact resistance of the organic base plate while supporting a high-temperature manufacturing process.
Implementation Method 1
A thermal expansion coefficient of the intermediate layer is smaller than that of the organic base plate and greater than that of the inorganic thin film
Data Source
AI summary
The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. An intermediate layer is formed on an organic base plate, a thermal expansion coefficient of the intermediate layer is smaller than that of the organic base plate and greater than that of an inorganic thin film, and the inorganic thin film is formed on the intermediate layer.