Intermediate Layer for Thin-Film Magnetic Head Substrates

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Solution Overview

Problem

Conventional thin-film magnetic head substrates face challenges in miniaturization due to heat dissipation issues and dielectric breakdown strength when reducing the thickness of the undercoat film, leading to potential read/write errors and increased manufacturing costs from using multiple sputtering systems.

Innovation Solution

A thin-film magnetic head substrate with a ceramic base and an undercoat film of aluminum oxide, featuring an intermediate layer made of a non-aluminum oxide material, such as a metal or Si film, to enhance dielectric breakdown strength and thermal conductivity, while maintaining electrical insulation properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of the undercoat film is reduced to enable miniaturization, then the overall size of the hard disk drive is reduced, but the dielectric breakdown strength decreases leading to potential read/write errors

Engineering Contradiction:
Improveoverall size of hard disk driveVSAvoiddielectric breakdown strength
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies composite materials by combining the undercoat film (aluminum oxide) with an intermediate layer (metal or silicon film) to create a multi-layer structure. This composite structure maintains high dielectric breakdown strength while allowing the overall insulating layer to be thinner, thus enabling miniaturization without sacrificing reliability.

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If the thickness of the undercoat film is reduced to enable miniaturization, then the overall size of the hard disk drive is reduced, but heat retention increases causing potential read/write errors

Engineering Contradiction:
Improveoverall size of hard disk driveVSAvoidheat retention
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The intermediate layer made of metal or silicon provides superior thermal conductivity compared to pure aluminum oxide. This composite structure efficiently conducts heat away from the transducer elements, preventing heat retention and associated errors while maintaining the thin profile needed for miniaturization.

Inventive Principle:
Principle #40Composite materials

3Volume of moving object

If the thickness of the undercoat film is reduced, then manufacturing costs increase due to the need for multiple sputtering systems, but miniaturization is achieved

Engineering Contradiction:
Improveoverall size of hard disk driveVSAvoidmanufacturing costs
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent segments the insulating structure into two functional layers: the undercoat film (aluminum oxide) and the intermediate layer (metal or silicon). This segmentation allows each layer to be deposited using standard sputtering equipment already present in manufacturing facilities, eliminating the need for specialized multiple sputtering systems and reducing manufacturing costs.

Inventive Principle:
Principle #1Segmentation

4Volume of moving object

If the undercoat film is made thinner to reduce slider size, then the cross-sectional area of the coil is reduced, but the quantity of heat generated per unit area increases

Engineering Contradiction:
Improveslider sizeVSAvoidheat generated per unit area
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The intermediate layer acts as a thermal intermediary between the coil and the undercoat film. It provides a high thermal conductivity pathway that efficiently transports heat away from the coil's cross-sectional area, reducing the heat generated per unit area and preventing energy loss while maintaining miniaturized dimensions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves dielectric breakdown strength and thermal conductivity, reducing the risk of electrostatic breakdown and heat retention, enabling the production of reliable, high-capacity, miniaturized hard disk drives with reduced manufacturing costs.

Implementation Method 1

intermediate layer made of a non-aluminum oxide material, such as a metal or Si film, to enhance dielectric breakdown strength and thermal conductivity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

undercoat film of aluminum oxide... exhibits a good electrical insulation property

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS8159783B2Substrate with intermediate layer for thin-film magnetic head and method of manufacturing the substrate with intermediate layer
Publication Date: 2012.04.17 PROTERIAL LTD
  • US8159783B2 patent drawing
  • US8159783B2 patent drawing
  • US8159783B2 patent drawing

AI summary

A thin-film magnetic head substrate according to the present invention includes: a ceramic base with a principal surface; and an undercoat film, which covers the principal surface of the ceramic base. An electrical/magnetic transducer is provided on the undercoat film. The substrate further includes an intermediate layer between the principal surface of the ceramic base and the undercoat film. The intermediate layer is made of a material other than an aluminum oxide and has been patterned so as to make a portion of the principal surface of the ceramic base contact with the undercoat film.