Intermediate Metal Terminal for Chip Component Joint Reliability

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Solution Overview

Problem

Conventional electronic devices with metal terminals face issues with joint reliability between chip components due to stress from substrate deformation and vibration, leading to potential cracks and disconnection.

Innovation Solution

An electronic device design featuring an intermediate metal terminal that connects terminal electrodes of chip components, along with outer metal terminals, to reduce stress and enhance joint reliability, allowing for secure connection and high capacitance configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If terminal electrodes of chip components are connected by solder for arrangement of multiple chip components in series, then the chip components can be electrically connected, but cracks are generated in the chip components and the connection between each chip component may be released due to stress from substrate deformation and vibration

Engineering Contradiction:
Improvejoint reliability between chip componentsVSAvoidstress from substrate deformation and vibration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An intermediate metal terminal is introduced as a mediator between the chip components and the outer metal terminal. This intermediate terminal absorbs and distributes the stress from substrate deformation and vibration, preventing direct stress transmission to the chip components and their solder joints, thereby maintaining connection reliability under mechanical stress

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The metal terminal structure is segmented into an intermediate metal terminal and an outer metal terminal. This segmentation allows the intermediate terminal to specifically handle stress absorption and distribution functions, while the outer terminal provides electrical connection, separating the stress management function from the electrical connection function to improve overall reliability

Inventive Principle:
Principle #1Segmentation

2Reliability

If an intermediate metal terminal is introduced to connect chip components and reduce stress, then joint reliability is improved, but the device structure becomes more complex

Engineering Contradiction:
Improvejoint reliability between chip componentsVSAvoidmetal terminal structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The intermediate metal terminal combines multiple functions into a single component: it serves as an electrical connector between chip components, a stress absorption element, and a structural support. By merging these functions into one integrated component rather than using separate elements, the design achieves improved reliability without proportionally increasing structural complexity

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11081275B2Electronic device
Publication Date: 2021.08.03 TDK CORP
  • US11081275B2 patent drawing
  • US11081275B2 patent drawing
  • US11081275B2 patent drawing

AI summary

An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.