Intermediate Plate for Heat Dissipation and Shock Resistance
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Solution Overview
Problem
Electronic apparatuses face challenges in heat dissipation and shock resistance due to large spacing between electronic components and casings, which hinders efficient cooling and increases the risk of deformation under impact.
Innovation Solution
Incorporating an intermediate plate between the top and bottom plates, along with heat dissipation sheets and strategically positioned vent holes, allows for improved airflow and heat dissipation while enhancing shock resistance by acting as a shock-absorber and maintaining a consistent clearance for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large space is provided between the electronic component and the casing, then heat dissipation is improved, but shock resistance deteriorates
Solution Approach 1:
The space between the electronic component and casing is divided into multiple segments by inserting intermediate plates at specific locations. This segmentation allows the structure to maintain larger overall spacing for heat dissipation while creating multiple smaller controlled gaps that provide shock absorption and structural support throughout the assembly.
Solution Approach 2:
Intermediate plates are introduced as intermediary elements between the electronic component and the casing. These plates serve dual functions: they maintain the necessary clearance for heat dissipation while also acting as shock-absorbing elements that improve the overall shock resistance of the assembly.
2Temperature
If a large space is provided between the electronic component and the casing, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The intermediate plates are designed to perform multiple functions simultaneously: they maintain clearance for heat dissipation, provide shock absorption, and serve as structural support elements. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
3Length of stationary object
If the apparatus height is reduced to meet small form factor standards, then compactness is improved, but heat dissipation deteriorates
Solution Approach 1:
The heat dissipation pathway is extended into the horizontal dimension by strategically positioning vent holes and intermediate plates along the length of the apparatus. This allows efficient heat dissipation to occur through lateral airflow paths rather than requiring increased vertical height, thus maintaining compact form factor while improving thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation and improved shock resistance, maintaining compliance with small form factor standards without altering the apparatus's height, while effectively cooling electronic components and suppressing deformation under impact.
Implementation Method 1
The intermediate plate is further configured to allow an air flow from a first end portion to a second end portion of the top plate
Implementation Method 2
the intermediate plate is configured to provide a clearance between the top plate and intermediate plate, or between the circuit board and the intermediate plate
Data Source
AI summary
An electronic apparatus includes a top plate, a bottom plate provided under the top plate, a circuit board provided between the top plate and the bottom plate, an electronic component disposed on the circuit board, and an intermediate plate provided between the top plate and the circuit board. The intermediate plate is configured to provide a clearance between the top plate and intermediate plate, or between the circuit board and the intermediate plate. The intermediate plate is further configured to allow an air flow from a first end portion to a second end portion of the top plate.