Intermetallic Joining Composition With Fine Grains for Heat Resistance
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Solution Overview
Problem
Conventional intermetallic compound members are difficult to deform plastically and prone to brittle fracture under mechanical stress due to thermal shock, limiting their application in joining objects where high heat resistance and mechanical stability are required.
Innovation Solution
A metal composition comprising a first metal, such as Sn or Sn-based alloys, and a second metal alloy with added transition metal elements like Co, Fe, or Cr, which reacts to form an intermetallic compound with a smaller average crystal grain size, enhancing plastic deformability and strength at high temperatures and room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional intermetallic compound member is used, then heat resistance is improved, but plastic deformability deteriorates and brittle fracture occurs under mechanical stress
Solution Approach 1:
The patent applies parameter changes by modifying the crystal grain size parameter of the intermetallic compound. Specifically, it controls the average crystal grain size to be 10 μm or less, which fundamentally changes the mechanical properties of the material. This parameter change enables the intermetallic compound to exhibit high plastic deformability at high temperatures while maintaining heat resistance, resolving the contradiction between heat resistance and plastic deformability.
Solution Approach 2:
The patent uses composite materials by creating an intermetallic compound with specific compositional ratios. The intermetallic compound comprises Sn and a CuNi alloy in a specific weight ratio range (Sn:CuNi = 4:6 to 3:7), and further includes transition metal elements (Co, Fe, or Cr) at controlled concentrations. This composite material approach with optimized composition enables both high heat resistance and improved plastic deformability.
2Ease of manufacture
If the average crystal grain size is large, then manufacturing is easier, but plastic deformability at high temperature deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the average crystal grain size parameter to be 10 μm or less. This parameter control is achieved through specific compositional design (Sn:CuNi ratio and transition metal content) and heating treatment conditions. The refined crystal grain structure enables high plastic deformability at high temperatures while maintaining manufacturability through controlled reaction processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting intermetallic compound member exhibits high plastic deformability at high temperatures, absorbs mechanical stress without brittle fracture, and maintains strength at room temperature, effectively joining objects with improved thermal and mechanical stability.
Implementation Method 1
The first metal and the second metal react with each other to produce an intermetallic compound
Implementation Method 2
the heating temperature is equal to or higher than the melting point of Sn and equal to or lower than a melting point of the CuNi alloy
Implementation Method 3
the intermetallic compound member with this constitution has high plastic deformability at high temperature... can absorb the mechanical stress and hardly causes brittle fracture
Data Source
AI summary
A metal composition that includes a first metal; and a second metal containing a first transition metal element added to a first alloy having a melting point higher than a melting point of the first metal, and the second metal is an alloy capable of producing an intermetallic compound with the first metal.