Cooling method and apparatus using internal circulation air flow
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Solution Overview
Problem
Heat accumulation between substrates affects the efficiency of cooling devices, necessitating a method to prevent heat accumulation and improve cooling efficiency by controlling air flow circulation.
Innovation Solution
An apparatus with substrates, fans, and a closed housing generates and controls air flows between substrates to circulate inside devices, using refrigerants and temperature sensors to adjust fan angles and speeds for optimal cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If devices are mounted on multiple substrates in parallel, then productivity is improved, but heat accumulation occurs in the space between substrates which worsens cooling efficiency
Solution Approach 1:
The patent extracts the heat accumulation problem from the inter-substrate space by introducing fans to actively remove hot air and replace it with cool air, preventing heat buildup that would otherwise affect device cooling efficiency
Solution Approach 2:
The patent uses pneumatic principles by employing fans to generate air flows that circulate through the heat accumulation space between substrates, using gas (air) movement to transfer heat away from the devices and maintain optimal temperatures
2Loss of energy
If air flow is generated in heat accumulation space, then heat removal is improved, but device cooling efficiency may worsen if air flow does not circulate inside devices
Solution Approach 1:
The patent applies nesting by having the air flow generated in the inter-substrate space penetrate and circulate through the devices themselves, creating a nested flow path where the external air flow system delivers cooling directly into the internal device structures
Solution Approach 2:
The patent uses air flow as an intermediary medium that transfers thermal energy from the heat accumulation space between substrates to the devices, facilitating heat removal while maintaining proper thermal management through controlled circulation
3Ease of operation
If fan angle and speed are manually controlled, then air flow direction and intensity can be adjusted, but automation level and response time to temperature changes worsen
Solution Approach 1:
The patent implements feedback control by using temperature sensors to continuously monitor the thermal state of devices and inter-substrate spaces, then automatically adjusting fan angles and speeds based on this temperature feedback to maintain optimal cooling conditions
Solution Approach 2:
The cooling system performs self-service by automatically detecting temperature changes through sensors and autonomously adjusting fan operations without manual intervention, enabling the system to self-regulate its cooling performance based on real-time thermal conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents heat accumulation and enhances cooling efficiency by automatically controlling air flow direction and intensity, maintaining device temperatures within a valid range.
Implementation Method 1
a first fan generating a first air flow in the first heat accumulation space
Implementation Method 2
a first substrate including first cooling means using a refrigerant that is circulated with the outside
Data Source
AI summary
An apparatus is provided. The apparatus includes: a first substrate including first cooling means using a refrigerant that is circulated with the outside; a second substrate disposed to be in parallel with, and apart from, the first substrate and thus to form first heat accumulation space between the first and second substrates, the second substrate including second cooling means using a refrigerant that is circulated with the outside; a first fan generating a first air flow in the first heat accumulation space in a direction parallel to the first and second substrates; and a housing of a closed structure.