Internal Antenna Wireless Communication Chip Integration
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Solution Overview
Problem
Existing communication modules require separate wireless communication chips and antennas, leading to increased manufacturing costs and difficulty in miniaturization due to the need for RF cables and potential resonance frequency variations with motherboard shape or size.
Innovation Solution
A wireless communication chip with an internal antenna is designed, where the antenna is embedded within the chip, eliminating the need for external RF cables and allowing for variable resonance frequencies through a layered structure with a radiator pattern, feeding pin, and ground units, and a second antenna exposed externally for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wireless communication chip and antenna are mounted as separate components, then communication function is achieved, but manufacturing cost increases and device miniaturization becomes difficult
Solution Approach 1:
The patent merges the wireless communication chip and antenna into a single integrated unit. The antenna is formed on the same substrate as the communication chip, with conductive patterns directly deposited on the substrate surface, eliminating the need for separate antenna components and RF cables. This integration reduces manufacturing complexity and cost while enabling device miniaturization.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the base for the wireless communication chip, the mounting platform for the antenna, and the connection medium between the two. The conductive patterns on the substrate serve both as electrical connections and as the antenna radiation elements, achieving multi-functionality that reduces overall system complexity.
2Ease of operation
If antenna is directly mounted on motherboard, then connection is simplified, but resonance frequency changes according to motherboard shape or size
Solution Approach 1:
The patent extracts the antenna from the motherboard environment and integrates it directly with the wireless communication chip on a separate substrate. This separation isolates the antenna from the motherboard's electromagnetic interference and geometric influences, stabilizing the resonance frequency while maintaining simple connections through the integrated structure.
Solution Approach 2:
The antenna is formed in a different dimensional configuration on the substrate surface, using conductive patterns that extend in specific directions to achieve stable radiation characteristics independent of the motherboard's three-dimensional structure. This dimensional separation from the motherboard resolves the frequency stability issue.
3Reliability
If RF cable is used to connect wireless communication chip and antenna, then electrical connection is established, but manufacturing cost increases and device size increases
Solution Approach 1:
The patent eliminates the RF cable by merging the electrical connection function with the substrate itself. The conductive patterns on the substrate serve as both the connection medium and the antenna structure, removing the need for separate cabling and reducing device volume.
Solution Approach 2:
The substrate acts as an intermediary that simultaneously provides mechanical support, electrical connection, and antenna radiation functionality. This eliminates the need for additional connection components like RF cables, reducing overall device size while maintaining reliable electrical connectivity.
Data Source
AI summary
A wireless communication chip having an internal antenna includes a substrate having first and second mounting regions; a wireless communication module molded on the first mounting region; and an antenna block mounted on the second mounting region to be electrically connected to the wireless communication module, wherein the antenna block includes a first antenna on the substrate; a connection element connected to the first antenna; an insulating layer on the first antenna and the connection element to cover the first antenna and the connection element; and a second antenna on the insulating layer such that a first surface of the second antenna is in contact with the insulating layer, and a second surface, which is a reverse surface of the first surface, is exposed to the outside of the wireless communication chip, wherein the second antenna is electrically connected to the first antenna through the connection element.