Internal Water-Cooling Radiator Structure to Prevent Leakage

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing water cooling heat dissipation devices face issues with water leakage and bulkiness due to connections through water pipes and joints, which can damage electronic components and complicate installation and maintenance.

Innovation Solution

An internal circulation water cooling heat dissipation device design featuring a water-cooling head with a chamber, a delivering structure with a water delivery column, and a water-cooling radiator with split tubes and nozzles, eliminating the need for long-distance connections and joints, thereby reducing the risk of water leakage and device size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If water cooling head, water pump and water-cooling radiator are connected through water pipes and joints, then heat dissipation efficiency is improved, but water leakage problems occur and device complexity increases

Engineering Contradiction:

Improvewater leakage preventionVSAvoidconnection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the water cooling head, water pump, and water-cooling radiator into a single integrated water cooling device. The water cooling head contains the chamber and water passages, the water pump is positioned within the same housing structure, and the water-cooling radiator is combined with the water cooling head through shared water passages. This merging eliminates the need for separate water pipes and joints connecting these components, thereby preventing water leakage while maintaining heat dissipation efficiency.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If traditional water cooling components are used with multiple connections, then heat dissipation function is achieved, but device size becomes bulky and occupies excessive space

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent combines multiple water cooling components into a single integrated device with a compact structure. The water cooling head, water pump, and water-cooling radiator are merged into one unitary structure where the water pump is positioned within the housing, and water passages are internally routed without external pipes. This integration dramatically reduces the overall device volume while maintaining effective heat dissipation functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If multiple water pipes and joints are used for connections, then heat dissipation components can be connected, but installation and maintenance processes become complicated

Engineering Contradiction:

Improveinstallation easeVSAvoidconnection structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes water leakage and reduces the overall size of the heat dissipation device, simplifying installation and maintenance while maintaining high heat dissipation efficiency.

Implementation Method 1

water cooling head... cools electronic components through internal water circulation, absorbing heat from the components

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

water circulation... absorbing heat from the components and transferring it to the water

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

water-cooling radiator... dissipates heat from the water to the surrounding air

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

dissipates heat from the water to the surrounding air through thermal conduction and convection

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 5

water pump circulates water through the heat dissipation device, maintaining continuous water flow

Methodology Applied

Scientific EffectPumping: Pump

Data Source

PatentUS12158307B2Internal circulation water cooling heat dissipation device

Publication Date: 2024.12.03 APALTEK CO LTD

AI summary

A water-cooling heat dissipation device includes a water cooling head, a delivering structure, a water-cooling radiator, and a water pump. The water-cooling head includes a chamber. The delivering structure is disposed on the water-cooling head and includes a water delivery column. The water delivery column includes a first and a second water passages. The first and second water passages are connected to the chamber.Multiple first and second slot holes are disposed on the first and second water passages respectively. The water-cooling radiator includes multiple tubes. A window is formed in the water-cooling radiator by splitting each tube. The water delivery column inserts in the window. Each first and second slot holes are welded to the nozzles of the tubes.