Internal EMI Shield for Optical Transceiver Modules

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Solution Overview

Problem

Optical transceiver modules face challenges in reducing electromagnetic interference (EMI) emissions due to their physical configuration, which leads to design complexity and excessive shielding material usage, especially as transmission speeds increase.

Innovation Solution

An internal EMI shield composed of electromagnetic field-attenuating materials, such as non-conductive polymers like silicone, is placed within the transceiver module to intercept and absorb EMI emitted by electronic components, preventing interference both within the module and with external components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If external EMI cages are used to shield transceiver modules, then EMI protection is improved, but device complexity and space requirements increase

Engineering Contradiction:

ImproveEMI protectionVSAvoiddesign complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The EMI shielding function is extracted from the external cage structure and integrated directly into the transceiver module housing. The housing itself is designed with EMI-shielding properties, eliminating the need for separate external shielding components and reducing overall device complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The EMI shielding function is merged with the transceiver module housing structure. The housing serves dual purposes: mechanical protection and EMI shielding, thereby reducing the number of separate components and simplifying the overall device design.

Inventive Principle:

Principle #5Merging (Combining)

2Object-affected harmful factors

If external EMI cages are used to shield transceiver modules, then EMI protection is improved, but the physical space required increases

Engineering Contradiction:

ImproveEMI protectionVSAvoidspace required

Core Design Contradiction:

Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If more shielding material is used to reduce EMI, then EMI protection is improved, but loss of substance and cost increase

Engineering Contradiction:

ImproveEMI protectionVSAvoidshielding material usage

Core Design Contradiction:

Object-affected harmful factorsVSLoss of substance

Solution Approach 1:

EMI shielding is applied locally at critical areas within the transceiver module where EMI generation and susceptibility occur, rather than using extensive shielding material throughout the entire device. This targeted approach reduces material consumption while maintaining effective EMI protection.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The internal EMI shield effectively reduces EMI emissions without adding design complexity or excessive material, maintaining existing transceiver form factors and ensuring compatibility with existing standards.

Implementation Method 1

a compliant shield composed of a material that attenuates electromagnetic fields, wherein the compliant shield is positioned within the housing such that it attenuates the electromagnetic field produced by the component

Methodology Applied

Scientific EffectElectromagnetic field attenuation: Absorption (EM radiation)

Data Source

PatentUS7917037B2Internal EMI shield for an optoelectronic module

Publication Date: 2011.03.29 II VI DELAWARE INC

AI summary

A shield device for preventing the emission of electromagnetic interference (“EMI”) from an optoelectronic device, such as an optical transceiver, is disclosed. In particular, an EMI shield is disclosed for placement within an optical transceiver module in order to intercept and absorb EMI produced by electronic components included within the transceiver. This absorption by the EMI shield prevents EMI from escaping the optical transceiver module and interfering with other electronic components that are typically placed in close proximity to the transceiver. The EMI shield in one embodiment includes a sheet of EMI absorbing material that is sized for placement within the transceiver. The EMI shield can be interposed between an outer shell of the transceiver and electronic components located on a printed circuit board that is disposed within the transceiver. The proximity of the EMI shield to the EMI-producing electronic components maximizes EMI absorption by the shield.