Internal Fan Heat Dissipation Device for Confined Spaces

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Solution Overview

Problem

Conventional heat dissipation devices with fans beside the fins are inefficient in space utilization, particularly in limited spaces, resulting in reduced cooling capacity.

Innovation Solution

A heat dissipation device with a housing and fins where the fan is disposed inside the hollow housing, allowing airflow to pass through the fins and base, increasing the cooling area and efficiency while maintaining a compact volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the fan is disposed beside the fins, then the structure is simple, but the space utilization is poor and cooling capacity is limited

Engineering Contradiction:
Improvestructure simplicityVSAvoiddevice volume
Core Design Contradiction:
Device complexityVSVolume of moving object

Solution Approach 1:

The fan is merged with the housing to form an integrated assembly, where the fan is disposed inside the hollow housing. This combines two previously separate components (fan and housing) into one unified structure, reducing the overall device volume while maintaining all necessary functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fan is nested inside the hollow housing, with the fan blades positioned within the internal cavity of the housing structure. This nesting arrangement allows the fan to be contained within the housing volume rather than occupying additional external space, achieving compact integration.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of operation

If the fan is disposed beside the fins, then the fan is easily accessible, but the cooling area is insufficient

Engineering Contradiction:
Improvefan accessibilityVSAvoidcooling area
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The cooling function transitions from relying on fan proximity to utilizing the three-dimensional fin structure. The fins extend in multiple directions from the base, creating a volumetric heat dissipation structure that increases cooling area without requiring additional fan placement options.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The housing is segmented into multiple fins that are sequentially arranged along a direction. Each fin acts as an independent heat dissipation element, and the cumulative effect of multiple fins provides extensive cooling surface area while maintaining a compact overall structure.

Inventive Principle:
Principle #1Segmentation

3Productivity

If more fins are added to increase cooling area, then cooling efficiency improves, but device volume increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoiddevice volume
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The fins are arranged sequentially along a specific direction from the base, creating a directional heat dissipation pattern. This localized arrangement optimizes the spatial distribution of cooling surfaces, providing maximum cooling efficiency within the constrained volume by concentrating heat dissipation structures in the most effective orientation.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances cooling efficiency and reduces noise, providing effective heat dissipation in confined spaces with a smaller volume.

Implementation Method 1

The fan is used for generating airflow flowing through the housing for cooling in a manner of convection

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heat generated by the heat source is transmitted to the fins 220 in a manner of heat conduction through the base 210

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10952348B2Heat dissipation device
Publication Date: 2021.03.16 ASUSTEK COMPUTER INC
  • US10952348B2 patent drawing
  • US10952348B2 patent drawing
  • US10952348B2 patent drawing

AI summary

A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.