Cooling Structure Using Internal Flow Channels for Smaller Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cooling structures for electronic components face challenges in enhancing cooling efficiency while maintaining miniaturization, high packing density, reduced weight, and thickness, especially with increasing heat generation demands.
Innovation Solution
A cooling structure that incorporates a heat radiating part with a medium flow path, where a medium flows through heat radiating fins and a heat conduction plate, utilizing natural convection to enhance heat dissipation, reducing the need for large heat sinks or increased cooling power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large-sizing of heat sink or increase of forced cooling power is adopted to cope with increased heat generation, then cooling effect is enhanced, but device size and weight increase
Solution Approach 1:
The patent introduces a liquid medium flow path system where cooling liquid circulates through channels formed in the substrate, directly absorbing heat from the heat-generating component. This hydraulic cooling approach replaces traditional air-cooled heat sinks, achieving superior heat removal efficiency with significantly reduced device size and weight.
Solution Approach 2:
The cooling liquid flow path is integrated within the substrate structure itself, with channels formed inside the substrate body. The heat-generating component is mounted on the substrate, and the cooling paths are nested within the substrate thickness, creating a compact integrated structure that eliminates separate heat sink components.
2Temperature
If large-sizing of heat sink is adopted to cope with increased heat generation, then cooling effect is enhanced, but device dimensions increase
Solution Approach 1:
The liquid medium flow path system enables high-efficiency heat removal within a compact volume by circulating cooling liquid through channels formed in the substrate. This approach achieves superior cooling performance without requiring large external heat sinks, thus reducing overall device volume.
Solution Approach 2:
The cooling function is transitioned from a two-dimensional surface heat sink to a three-dimensional internal flow path system within the substrate. By utilizing the substrate thickness and creating internal channels, the patent achieves efficient heat removal in a compact volumetric configuration rather than requiring expanded surface area.
3Temperature
If conventional cooling structure is used, then manufacturing process is simple, but cooling efficiency is insufficient for high heat generation
Solution Approach 1:
The cooling function is merged with the substrate structure by forming cooling liquid flow paths directly within the substrate body. The substrate simultaneously serves as the mounting platform for heat-generating components and as the cooling system, integrating multiple functions into a single component and reducing overall system complexity.
Solution Approach 2:
The substrate is designed to perform multiple functions: it serves as the structural support for mounting heat-generating components, as the heat transfer medium container, and as the cooling system itself through its internal flow paths. This multi-functional design eliminates the need for separate cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances cooling efficiency by discharging most heat through the medium flow path and residual heat through heat radiation fins, allowing for miniaturization of the cooling structure while maintaining effective heat management.
Implementation Method 1
through which a medium flows in the heat radiating part
Implementation Method 2
heat generated in an integrated circuit device mounted on a circuit board is transferred to a heat sink
Implementation Method 3
heat is radiated by the heat sink
Data Source
AI summary
To provide a cooling structural body which can enhance a cooling effect and can easily correspond to small-sizing and the like.The cooling structural body includes a heat radiating part having a mounting surface 2a on which an electronic component 101 is directly or indirectly mounted. A medium flow path through which a medium can flow is provided in the heat radiating part.