Internal Frame Heat Isolation Layer for Portable Electronics
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Solution Overview
Problem
The increasing size and decreasing thickness of portable electronic devices lead to poor heat dissipation, causing high temperatures in the internal frame, which makes them uncomfortable to hold and use due to transferred heat.
Innovation Solution
An internal frame structure with a heat isolation layer positioned between the inner and outer layers, made of thermal insulation material, to prevent heat from being transferred to the outer periphery, allowing the heat to be dissipated internally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the device size is increased and thickness is decreased to improve portability, then the device becomes more portable, but the heat dissipation performance deteriorates
Solution Approach 1:
The frame unit is divided into three distinct layers: inner layer, heat isolation layer, and outer layer. This segmentation allows heat to be managed at different stages - absorbed by the inner layer, isolated by the middle layer, and prevented from reaching the outer layer, thereby solving the heat dissipation problem in thin portable devices
Solution Approach 2:
The heat isolation layer acts as an intermediary between the heat-generating inner layer and the user-contacting outer layer. This intermediate thermal insulation layer blocks heat transfer, allowing the device to remain portable while preventing excessive heat from reaching the user's hand
2Ease of operation
If heat is isolated from the outer layer to improve user comfort, then user comfort is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The harmful heat energy is extracted and contained within the inner layer and heat isolation layer, separating it from the outer layer that contacts the user. This extraction of heat from the user-contact zone improves comfort while the heat is still managed within the device structure through the layered configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively isolates heat from the internal components, preventing it from reaching the user's hand and ensuring the device can be comfortably held and used without discomfort.
Implementation Method 1
a heat isolation layer positioned between the inner layer and the outer layer... the heat isolation layer of the frame unit is made of thermal insulation material
Data Source
AI summary
An internal frame structure with heat isolation effect and an electronic apparatus with the internal frame structure. The internal frame is applied to the electronic apparatus. The internal frame includes a main body and a frame unit. The frame unit includes an inner layer, an outer layer and a heat isolation layer positioned between the inner layer and the outer layer. The inner layer is adjacently connected with the main body. The outer layer is positioned on an outermost side of the frame unit. The heat isolation layer serves to isolate the heat of the main body from being transferred to the outer layer of the frame unit.