Immersion Cooling With Internal Heat Exchange and Microchannels

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Solution Overview

Problem

Existing immersion cooling systems require longer communication pipelines and higher pumping power due to the cooling device being external to the system, leading to inefficiencies in cooling performance.

Innovation Solution

An immersion cooling system with a work tank, chip device, microchannel device, and internal heat exchange components that facilitate direct communication and circulation of a liquid-phase working fluid, reducing the need for external cooling devices and minimizing pipeline length.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the cooling device is placed outside the system, then the cooling function is provided, but the communication pipeline length increases and pumping power consumption increases

Engineering Contradiction:

Improvecooling performanceVSAvoidcommunication pipeline length

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The cooling device is merged with the work tank by integrating the heat exchange device directly inside the tank. The communication pipeline is incorporated into the chip device structure, creating an integrated cooling system that eliminates external piping while maintaining effective cooling functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The microchannel device is nested within the chip device, and the communication pipeline is nested within the chip device structure. The heat exchange device is nested within the work tank, creating a compact hierarchical arrangement that reduces overall system footprint and pipeline length.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Temperature

If the cooling device is placed outside the system, then the cooling function is provided, but the pumping power consumption increases

Engineering Contradiction:

Improvecooling performanceVSAvoidpumping power consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The cooling device is merged with the work tank, eliminating the need for long external pipelines. This integration reduces the total pipeline length and associated pressure losses, thereby reducing the pumping power required to circulate the working fluid through the system.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The microchannel device incorporates passive cooling mechanisms that reduce reliance on high-power pumping systems. The integrated design allows for more efficient fluid distribution with lower pressure requirements.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If the communication pipeline is lengthened, then the cooling coverage is extended, but the energy loss increases

Engineering Contradiction:

Improvecooling coverageVSAvoidenergy loss

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The communication pipeline is nested within the chip device structure, minimizing the external pipeline length. The microchannel device is nested within the chip device, creating a compact configuration that provides adequate cooling coverage while minimizing energy losses in the communication pipeline.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves efficient cooling of components by recycling and reusing the working fluid, minimizing contamination, and reducing energy consumption through internal heat exchange and capillary action, thereby enhancing cooling performance.

Implementation Method 1

The microchannel device is in the chip device. A first end of the microchannel device is in communication with the inlet, and a second end of the microchannel device is in communication with the outlet

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

enhancing cooling performance through internal heat exchange and capillary action

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS12414268B2Immersion cooling system

Publication Date: 2025.09.09 WIWYNN CORP

AI summary

An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.