Internal Laser Detachment Region for Thick Solid Separation
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Solution Overview
Problem
Conventional methods for separating solid portions, such as wafers, through sawing result in material waste, surface damage, and high costs due to thermal stress and distortion caused by laser irradiation, limiting the processing of thick and large solids.
Innovation Solution
A method involving laser radiation that penetrates into the solid to create a detachment zone by modifying the crystal lattice, allowing for controlled material conversion and reduction in strength without local destruction, enabling precise separation of solid layers without shortening the solid orthogonally and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sawing method is used to separate solid portions, then separation can be achieved, but material costs increase due to chips and surface damage
Solution Approach 1:
The patent replaces the mechanical sawing system with a laser-based system that uses optical energy to modify the crystal lattice and induce fissures. This substitution eliminates mechanical contact, preventing surface damage and chip generation while maintaining separation capability.
Solution Approach 2:
The patent changes the physical state and properties of the material through laser-induced modifications. By controlling laser parameters (energy density, pulse duration, wavelength) to create specific crystal lattice modifications and thermal stresses, the material undergoes controlled transformation that enables clean separation without mechanical damage.
2Manufacturing precision
If laser irradiation is applied to achieve separation, then separation can be achieved, but thermal stress causes solid distortion and expansion
Solution Approach 1:
The patent applies laser irradiation locally to specific regions rather than uniformly heating the entire solid. By focusing laser energy on predetermined portions to create localized crystal lattice modifications and fissures, the method achieves precise separation while minimizing overall thermal stress and distortion of the solid structure.
Solution Approach 2:
The patent performs preliminary crystal lattice modifications and fissure creation through laser irradiation before final separation. This preliminary action prepares the material structure in advance, allowing controlled detachment along predetermined paths without requiring excessive thermal stress that would cause distortion.
3Manufacturing precision
If high temperatures are applied for material conversion, then detachment zone can be formed, but crystal lattice modifications become imprecise
Solution Approach 1:
The patent employs periodic laser pulsing to deliver energy in controlled intervals rather than continuous heating. This periodic action allows precise temperature control, enabling material conversion and crystal lattice modifications at optimal temperatures without excessive heat accumulation that would reduce modification precision.
4Manufacturing precision
If laser beams penetrate via surface into solid, then detachment zone can be formed, but severe heating of solid occurs
Solution Approach 1:
The patent focuses laser beams to penetrate and act only on predetermined local portions of the solid rather than heating the entire material. By concentrating energy on specific regions where detachment zones are needed, the method achieves precise detachment zone formation while minimizing overall solid heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise and controlled separation of solid layers with minimal material loss and reduced thermal stress, enabling the processing of larger and thicker solids with reduced material costs and surface damage.
Implementation Method 1
subjecting the solid to laser radiation from the laser light source, wherein the laser beams penetrate into the solid via a surface of the solid portion to be cut off
Implementation Method 2
a plurality of modifications are successively produced in the crystal lattice of the solid, wherein as a result of the modifications the crystal lattice fissures in the regions surrounding the modifications
Implementation Method 3
The temperature produced in the predefined portion of the solid is so high that the material forming the predefined portion undergoes modification in the form of a predetermined material conversion
Data Source
AI summary
A method for producing a detachment region in a solid-state body includes: providing a solid body that consists of a chemical compound comprising a combination of elements from the 3rd, 4th and 5th main group and subgroup 12 of the Periodic Table of the Elements; providing a laser light source; and exposing the solid body to laser beams from the laser light source. The laser beams penetrate into the solid body via a main surface of the solid body and are applied in a defined manner on a predefined portion of the solid body within the solid body to form a detachment region. The application of the laser beams successively creates multiple modifications in a crystal lattice of the solid body which, as a result of the modifications, fissures in a subcritical manner at least in a portion in each case in regions that surround the modifications.