Internal Light Curing for Electronic Device Joints
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Solution Overview
Problem
Conventional electronic devices often fail to effectively cure light curable adhesives within joints, resulting in vulnerable or undesirable adhesive bonds, which can lead to joint failures and increased manufacturing complexity.
Innovation Solution
The implementation of electronic devices with internal or external light sources, such as UV LEDs, and light pipes to partially cure light curable adhesives during assembly, combined with humidity exposure for full curing, ensuring stronger and more reliable joint bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If light curable adhesive is used to bond components at internal joints, then bonding strength is improved, but the adhesive cannot be cured properly in conventional devices without light access
Solution Approach 1:
The patent applies preliminary action by providing a fixture cure of the adhesive before final assembly is complete. The light source is positioned and activated to cure the adhesive in its applied state, establishing initial bond strength before components are fully assembled and sealed. This preliminary curing action resolves the contradiction by enabling partial cure when light access is still available, ensuring both strength and reliability.
Solution Approach 2:
The patent introduces an intermediary light source within the device that mediates between the adhesive and external light. This internal light source (such as a UV LED) acts as an intermediary to deliver curing light directly to the adhesive at internal joints where external light cannot reach, resolving the contradiction by enabling complete curing of light-curable adhesive in previously inaccessible locations.
2Ease of manufacture
If conventional assembly methods are used without internal light curing, then manufacturing process is simpler, but joint reliability is compromised
Solution Approach 1:
The patent applies universality by designing the light source to serve multiple functions: it cures the adhesive during assembly and later serves as a functional light source for the device (such as an indicator LED). This multi-functionality resolves the contradiction by adding curing capability without significantly increasing overall device complexity, as the same component performs both curing and operational functions.
Solution Approach 2:
The patent applies self-service by having the device's own operational light source perform the adhesive curing function. The LED or other light-emitting component that will function during device operation is used to cure the adhesive during assembly, eliminating the need for a separate dedicated curing light source and simplifying the manufacturing process while ensuring reliable bonding.
3Reliability
If internal light source is added for adhesive curing, then adhesive curing capability is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by designing the light source to serve multiple functions: it cures the adhesive during assembly and later serves as a functional light source for the device (such as an indicator LED). This multi-functionality resolves the contradiction by adding curing capability without significantly increasing overall device complexity, as the same component performs both curing and operational functions.
Solution Approach 2:
The patent applies self-service by having the device's own operational light source perform the adhesive curing function. The LED or other light-emitting component that will function during device operation is used to cure the adhesive during assembly, eliminating the need for a separate dedicated curing light source and simplifying the manufacturing process while ensuring reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the strength and reliability of internal joints in electronic devices, simplifies manufacturing, and reduces the risk of joint failures by achieving a strong fixture cure within minutes, with full curing occurring over time through humidity exposure.
Implementation Method 1
the light source is a UV light source
Implementation Method 2
a light curable adhesive bonding the components at the joint
Data Source
AI summary
Various implementations include electronic devices with internal joints cured by a light source. In a particular implementation, an electronic device includes: a casing defining an enclosure; a joint between components in the electronic device; a light curable adhesive bonding the components at the joint; and at least one light source internal to the casing and configured to output light for at least partially curing the light curable adhesive in the casing.