Internal Slot Valve Layout for Symmetric Plasma Processing Chambers
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Solution Overview
Problem
Existing substrate processing apparatuses have asymmetrical reaction spaces due to empty spaces formed between the slot valve and the opening, leading to non-uniform plasma distribution and processing environments, making it difficult to uniformly perform etching or deposition on semiconductor substrates.
Innovation Solution
A substrate processing apparatus with a valve system that includes a blade housed in the chamber, which can be raised and lowered to close the opening, forming a symmetrical reaction space by blocking the slot and creating a uniform processing environment by ensuring the opening is covered to form the same plane as another sidewall.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an external slot valve is used to open/close the slot, then the substrate can be transferred into or from the processing chamber, but an empty space is formed between the slot valve and the opening, causing asymmetrical reaction space and non-uniform plasma distribution
Solution Approach 1:
The invention extracts the valve mechanism from the external position and relocates it inside the processing chamber. The slot valve is repositioned within the chamber body, eliminating the external empty space that caused asymmetry. This internal relocation maintains substrate transfer functionality while ensuring the reaction space remains symmetrical and plasma-distribution-uniform during processing operations.
2Productivity
If the slot is opened by an external slot valve, then substrate transfer is enabled, but the reaction space becomes asymmetrical making uniform etching or deposition difficult
Solution Approach 1:
The invention introduces an intermediate structure - the chamber body itself - to house the slot valve mechanism. By making the chamber body the intermediary that contains both the valve and the reaction space, the design eliminates the external empty space problem. The valve operates from within the chamber, serving as an internal mediator that enables substrate transfer without compromising reaction space symmetry or process uniformity.
Data Source
AI summary
Disclosed is a substrate processing apparatus having a symmetrical reaction space in which a process is performed after a substrate is transferred into the reaction space. The substrate processing apparatus may include: a chamber including a reaction space having an opening formed at one or more sidewalls; and a valve configured to open/close the opening. The valve may include: a blade housed in the chamber including the sidewall and a chamber bottom, which form the reaction space, and configured to open/close the opening; and a driving unit configured to raise and lower the blade, wherein one surface of the blade is formed as the same plane as the inner surface of the chamber by the closing of the opening.