Electronic Package Power Path Using Internal Wires and Conductive Layer
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Solution Overview
Problem
Conventional semiconductor packages face issues with high DC resistance and power outages due to long power transmission paths, leading to increased impedance and inadequate power supply to electronic components positioned further from the center of the first semiconductor chip in Fan-Out Embedded Bridge (FO-EB) packaging.
Innovation Solution
The design includes an electronic package with a first electronic component having an active surface, a non-active surface, and side surfaces, featuring electrode pads on the active surface connected by wires inside the component, and a conductive layer formed on the non-active and side surfaces, which serves as a power transmission structure within the encapsulant, reducing DC resistance by forming additional current paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power is transmitted through the circuit layer and conductive pillars in conventional FO-EB packaging, then the power transmission path is established, but the DC resistance increases and power supply becomes insufficient for electronic components positioned further from the center
Solution Approach 1:
The power transmission function is segmented into multiple independent paths: the original circuit layer and conductive pillars path, and the new wire-based path through the first electronic component. This segmentation allows power to be distributed through parallel routes, reducing overall DC resistance and improving power supply reliability for distant components.
Solution Approach 2:
The first electronic component acts as an intermediary structure that houses wires providing an alternative power transmission path. These wires serve as mediators between the power source and electronic components, creating additional current paths that reduce DC resistance and prevent power outages.
2Productivity
If electronic components are positioned above the routing structure in FO-EB packaging, then the package density and functionality are improved, but the power transmission distance increases causing impedance issues and power outages
Solution Approach 1:
The power transmission approach transitions from a two-dimensional planar path through the circuit layer to a three-dimensional path utilizing vertical conductive pillars and wires embedded within the first electronic component. This dimensional change shortens the effective power transmission distance and provides multiple spatial routes for current flow, reducing impedance and improving power stability.
Solution Approach 2:
The wires are nested inside the first electronic component, which itself is embedded in the encapsulant. This nested structure allows the power transmission wires to be integrated within the existing package architecture, providing additional current paths without increasing the overall package footprint, thereby maintaining high functionality while improving power supply reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces DC resistance and improves power supply efficiency by creating additional current paths using electrode pads, wires, and conductive layers, effectively addressing the impedance issues in FO-EB packaging.
Implementation Method 1
at least one wire electrically connected with the electrode pad is provided inside the first electronic component... the wire is electrically connected with the electrode pad and the conductive layer
Data Source
AI summary
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.