Internested Frame Receptacle for Midplane Signal Integrity
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Solution Overview
Problem
Conventional orthogonal midplane connector systems face limitations in contact density and signal integrity due to complex and costly routing of signals through header connectors and midplane circuit boards, often resulting in signal degradation.
Innovation Solution
A receptacle assembly with a conductive holder and frame assembly providing electrical shielding, featuring internested frames with bridges and coupling members to enhance contact density and signal integrity, allowing for direct via connections without the need for trace routing between header assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional orthogonal connectors are used with 90° rotation in the midplane assembly, then the contact density can be increased, but the signal integrity deteriorates due to complex routing through header connectors and midplane circuit board
Solution Approach 1:
The patent implements internesting of frame members where the first frame member is received within the second frame member and vice versa, creating a nested configuration that enables direct via connections through the midplane board without requiring complex trace routing, thereby maintaining signal integrity while achieving high contact density
Solution Approach 2:
The patent transitions from planar signal routing to three-dimensional internesting of frames, allowing signal paths to proceed directly through vias in the midplane board rather than following complex two-dimensional traces, thus improving signal integrity while maintaining compact high-density contact arrangement
2Quantity of substance
If conventional orthogonal connectors with 90° rotation are implemented, then contact density can be increased, but the manufacturing complexity and cost increase due to complex trace routing requirements
Solution Approach 1:
The internested frame configuration simplifies the overall system architecture by eliminating the need for complex trace routing on the midplane circuit board, reducing manufacturing complexity and cost while maintaining high contact density through efficient spatial arrangement
Solution Approach 2:
The patent extracts the signal routing function from the midplane circuit board traces and replaces it with direct via connections enabled by the internested frame structure, thereby eliminating complex routing requirements and associated manufacturing complexity
3Ease of manufacture
If identical receptacle assemblies are used on both sides of the midplane, then manufacturing simplicity is maintained, but signal integrity deteriorates due to complex routing requirements
Solution Approach 1:
The internested frame design enables identical receptacle assemblies to be used on both sides of the midplane while achieving direct via connections that eliminate complex trace routing, thereby maintaining both manufacturing simplicity and signal integrity simultaneously
4Quantity of substance
If frames are internested to increase contact density, then more contacts can be accommodated, but shielding requirements increase to maintain signal integrity
Solution Approach 1:
The nested frame configuration naturally provides shielding as each frame member surrounds the other, creating inherent electromagnetic shielding that protects against electrical interference while enabling high contact density through compact internesting
Solution Approach 2:
The conductive holder acts as an intermediary shielding element that receives both internested frames and provides 360° electrical shielding around the signal contacts, preventing electrical interference while allowing high-density contact arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases contact density and improves signal integrity by eliminating the need for trace routing, reducing manufacturing complexity and cost while maintaining performance, and providing 360° shielding for differential signal pairs.
Implementation Method 1
The conductive holder provides electrical shielding for the frame assembly
Data Source
AI summary
A receptacle assembly includes a contact module having a conductive holder and a frame assembly received in the conductive holder. The frame assembly includes a first frame and a second frame, each frame having at least two frame members each supporting a differential pair of receptacle signal contacts and being separated by a gap. The first and second frames are interested such that at least one frame member of the first frame is received in a corresponding gap of the second frame between frame members of the second frame and such that at least one frame member of the second frame is received in a corresponding gap of the first frame between frame members of the first frame.