Interpenetrating Network Organic Silicon Resin Adhesion to Copper
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Solution Overview
Problem
Organic silicon resin exhibits poor adhesion to copper materials, which is a significant technical shortcoming in existing technologies.
Innovation Solution
An interpenetrating network type organic silicon resin is developed, comprising a specific ratio of polysiloxane oligomer, alkoxysilane, polyester resin, epoxy resin, acrylic resin, polymerization reaction catalyst, solvent, and amino resin, which are processed through a multi-step polymerization and solvent adjustment method to enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional organic silicon resin is used, then high and low temperature resistance, hydrophobicity, and electrical insulation are achieved, but adhesion to copper materials is poor
Solution Approach 1:
The patent creates a composite resin system by combining organic silicon resin with epoxy resin and acrylic resin in specific ratios. This composite formulation integrates the temperature resistance and hydrophobicity of organic silicon resin with the copper adhesion properties of epoxy and acrylic resins, achieving both thermal stability and improved adhesion to copper materials simultaneously
Solution Approach 2:
The patent modifies the chemical composition parameters of the resin system by incorporating specific functional groups and adjusting the ratios of polysiloxane oligomer, polyester resin, epoxy resin, and acrylic resin. These parameter changes enable the resin to maintain its inherent properties while gaining enhanced adhesion capability to non-ferrous metals like copper
2Productivity
If polymerization reaction is performed at high temperature, then polymerization speed increases, but resin quality and adhesion may deteriorate
Solution Approach 1:
The patent employs a two-stage polymerization process where a pre-reaction step is conducted at lower temperature (50-100°C) before the main polymerization. This preliminary action allows gradual chain formation and prevents runaway reactions, ensuring resin quality while maintaining overall productivity through the subsequent high-temperature polymerization stage
Solution Approach 2:
The patent implements periodic temperature control during polymerization, alternating between lower temperature pre-reaction phase and higher temperature main reaction phase. This periodic temperature profile optimizes both reaction speed and resin quality by preventing thermal degradation while ensuring complete polymerization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting interpenetrating network type organic silicon resin demonstrates improved adhesion to non-ferrous metals, particularly copper materials and copper alloys, extending their service life and providing enhanced protection.
Implementation Method 1
a polymerization reaction catalyst... the polymerization reaction catalyst is a mixture of at least three metal organic carboxylate, titanate, and organic tin catalysts
Implementation Method 2
the structural formula of the alkoxysilane is R1Si(OR2)3... the mass fraction of the alkoxysilane in the polysiloxane oligomer is 0.5-18%
Data Source
AI summary
Disclosed in the present invention are an interpenetrating network type organic silicon resin and a preparation method therefor. The raw materials of the interpenetrating network type organic silicon resin include a polysiloxane oligomer, an alkoxysilane, a polyester resin, an epoxy resin, an acrylic resin, a polymerization reaction catalyst, a polymerization reaction solvent and an amino resin, wherein the mass ratio of the polysiloxane oligomer to the polyester resin to the epoxy resin to the acrylic resin is 1:(0.25-0.96):(0.05-0.64):(0.10-0.81); the mass fraction of the alkoxysilane in the polysiloxane oligomer is 0.5-18%; and the amino resin accounts for 1-25% of the total mass of the polysiloxane oligomer, the polyester resin, the epoxy resin and the acrylic resin.