Interposer with Acoustic Noise Reduction Layers
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Solution Overview
Problem
Existing electronic components with interposers suffer from defects during surface mounting operations due to improper electrode patterns, leading to acoustic noise issues in multilayer capacitors.
Innovation Solution
An interposer design featuring specific conductive patterns and layers on its surface, including shape-securing and acoustic noise reduction layers, to prevent defects and reduce acoustic noise, with precise thickness and area ratios to ensure accurate mounting and effective noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between the multilayer capacitor and the substrate, then acoustic noise is reduced, but electrode pattern defects occur during surface mounting operation
Solution Approach 1:
The upper conductive pattern is segmented into multiple layers (first conductive layer, second conductive layer, third conductive layer, fourth conductive layer) with each layer having specific thickness constraints. This segmentation allows the electrode pattern to maintain both the acoustic noise reduction function and the manufacturing precision required for defect-free surface mounting operations.
2Object-affected harmful factors
If the conductive layers are made thicker to improve acoustic noise reduction, then noise reduction effect increases, but manufacturing precision and alignment accuracy decrease
Solution Approach 1:
Specific thickness parameters are defined for each conductive layer: the first and second conductive layers have thicknesses of 10 μm or less, while the third and fourth conductive layers have thicknesses of 20 μm or less. These parameter constraints optimize the balance between acoustic noise reduction and manufacturing precision, ensuring that the electrode pattern can be accurately formed during surface mounting operations while still providing effective noise reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer design effectively prevents surface mounting defects and significantly reduces acoustic noise in multilayer capacitors by ensuring accurate electrode alignment and vibration absorption.
Implementation Method 1
the first and second conductive layers may be shape-securing layers
Implementation Method 2
the third and fourth conductive layers may be acoustic noise reduction layers
Implementation Method 3
effectively reducing the acoustic noise of the multilayer capacitor
Implementation Method 4
since the dielectric layer has piezoelectricity and electrostrictivity, when a DC or AC is applied to the multilayer capacitor, a piezoelectric phenomenon occurs between the internal electrodes, which may cause periodic vibrations while expanding and contracting a volume of a capacitor body
Implementation Method 5
since the dielectric layer has piezoelectricity and electrostrictivity
Implementation Method 6
Such vibrations may be transmitted to a substrate through a solder, connecting an external electrode of the multilayer capacitor and the substrate
Data Source
AI summary
An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.