Interposer Adhesive Array for Electronic Component Heat Transfer
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Solution Overview
Problem
Electronic components with interposers face challenges in uniformly transferring heat, leading to potential degradation or malfunction due to temperature rises, especially in components like multilayer ceramic capacitors, inductors, and varistors.
Innovation Solution
The electronic component with an interposer features a two-dimensional array of unitary adhesive sections between the component and the substrate, with a higher concentration of adhesive sections at the center and fewer on the sides, facilitating uniform heat transfer based on the temperature distribution to prevent component degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a uniform adhesive section is used between the electronic component and interposer, then the bonding strength is sufficient, but the heat transfer becomes non-uniform causing temperature rise
Solution Approach 1:
The adhesive section is designed with non-uniform distribution where the density of adhesive units varies by location. Specifically, the adhesive units are arranged more densely in regions farther from the center and less densely near the center, creating local variations in adhesive properties that correspond to the temperature distribution pattern, with higher heat generation at the edges requiring stronger adhesive coupling for heat transfer.
Solution Approach 2:
The adhesive section is segmented into multiple discrete adhesive units rather than being a continuous uniform layer. These plurality of adhesive units are distributed across the bonding interface with varying densities in different regions, allowing independent optimization of heat transfer characteristics in different zones of the electronic component.
2Temperature
If the adhesive section is concentrated at the center, then heat transfer from the center is improved, but edge regions suffer from insufficient heat transfer
Solution Approach 1:
The adhesive units are distributed with location-dependent density to match the local heat generation characteristics. Regions that generate more heat (typically edges in electronic components) have higher density of adhesive units to enhance heat transfer capability locally, while center regions with lower heat generation have correspondingly lower adhesive density.
Solution Approach 2:
The adhesive distribution is optimized in two dimensions across the bonding interface rather than being uniform throughout. The density of adhesive units varies spatially in the plane of the bonding interface, creating a gradient distribution that addresses heat transfer needs across different regions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures effective heat transfer from the electronic component to the interposer, maintaining uniform temperature and preventing degradation or malfunction, even under temperature distribution variations.
Implementation Method 1
it is significantly important in practical sense that heat be uniformly transferred from the main body of the electronic component to the interposer
Data Source
AI summary
The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.