Interposer Containment Structure for Adhesive Control
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Solution Overview
Problem
The existing methods for mounting shielding layers or heat spreaders onto semiconductor dies and substrates often result in cover tilt or excess adhesive bleed-out, leading to defects and increased manufacturing costs due to uneven or insufficient adhesive deposition.
Innovation Solution
A method involving the formation of a containment structure over the substrate surface within the cover attach area, followed by the deposition of an adhesive material and the controlled placement of the cover to prevent adhesive flow and ensure proper alignment and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive material is deposited over the cover or substrate without a containment structure, then the deposition process is simple, but the adhesive material bleeds out from the cover causing defects
Solution Approach 1:
A containment structure is formed on the substrate before adhesive deposition. This preliminary structure prevents adhesive bleed-out during the bonding process, eliminating defects while maintaining process simplicity. The containment structure acts as a pre-established barrier that guides adhesive material staying within the cover attach area.
2Productivity
If adhesive material is deposited unevenly or insufficiently, then the deposition process is fast, but cover tilt occurs leading to reliability issues
Solution Approach 1:
The containment structure is prepared in advance to provide a defined area for adhesive deposition. This allows for faster, more consistent adhesive application since the target area is pre-marked by the containment structure boundaries, ensuring uniform distribution and preventing cover tilt while maintaining high productivity.
Solution Approach 2:
The containment structure creates a localized region with specific properties (defined boundaries) that concentrates and controls the adhesive material exactly where needed. This local control ensures proper adhesive distribution for reliable cover bonding without requiring complex overall process control.
3Device complexity
If no containment structure is used, then the device structure is simple, but excess adhesive bleed-out increases manufacturing defects
Solution Approach 1:
The containment structure is formed as a preliminary feature on the substrate before the bonding process. This simple pre-formed structure (can be a raised rim, groove, or patterned layer) defines the adhesive application area, preventing bleed-out without adding complex active components to the final device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents cover tilt and adhesive bleed-out, enhancing the reliability of EMI and RFI shielding and heat dissipation while reducing manufacturing defects and costs.
Implementation Method 1
depositing an adhesive material over the cover or substrate, and disposing the cover over the substrate within the cover attach area to press the adhesive material into or against the containment structure
Implementation Method 2
forming a containment structure over a surface of the substrate within a cover attach area of the substrate
Data Source
AI summary
A semiconductor device has an interposer with a die attach area interior to the interposer and cover attach area outside the die attach area. A channel is formed into a surface of the interposer within the cover attach area. A dam material is formed over the surface of the interposer within the cover attach area between the channel and edge of the interposer. A semiconductor die is mounted to the die attach area of the interposer. An adhesive material is deposited in the cover attach area away from the channel and dam material. A cover, such as a heat spreader or shielding layer, is mounted to the die and interposer within the cover attach area. The cover presses the adhesive material into the channel and against the dam material to control outward flow of the adhesive material. Alternatively, ACF can be formed over the interposer to mount the cover.