Semiconductor device including binding agent adhering an integrated circuit device to an interposer

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving efficient three-dimensional integration of integrated circuit devices due to limitations in bonding integrated circuit chips directly onto substrates, leading to issues with short circuits and increased manufacturing costs.

Innovation Solution

The use of photosensitive adhesive films and reflowable layers to form conductive connectors between integrated circuit devices and substrates, creating air gaps that prevent short circuits and allow for finer pitch connections, while simplifying the bonding process and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If integrated circuit chips are bonded directly onto substrates, then bonding efficiency is improved, but the risk of short circuits increases and manufacturing costs increase

Engineering Contradiction:

Improvebonding efficiencyVSAvoidshort circuit risk

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent introduces an interposer as an intermediary component between the integrated circuit chip and substrate. The interposer includes binding agents that adhere to both the chip and substrate, creating a buffered connection that prevents direct contact between conductive elements. This intermediary structure reduces short circuit risk while maintaining bonding efficiency through the binding agent's adhesive properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The binding agent layer is applied beforehand to create a cushioning effect between the chip and substrate. This layer acts as a buffer that prevents direct electrical contact between conductive elements on the chip and substrate, thereby reducing short circuit risk before bonding occurs. The binding agent's thickness and material properties provide this protective cushioning.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Device complexity

If integrated circuit chips are bonded directly onto substrates, then bonding process is simplified, but manufacturing costs increase

Engineering Contradiction:

Improvebonding process complexityVSAvoidmanufacturing cost

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The patent merges multiple functions into the binding agent: adhesion to both chip and substrate, electrical isolation to prevent short circuits, and mechanical buffering. By combining these functions into a single component, the overall device complexity is reduced while maintaining ease of manufacture through a streamlined bonding process that doesn't require additional isolation layers or complex alignment procedures.

Inventive Principle:

Principle #5Merging (Combining)

3Manufacturing precision

If conductive connectors are formed with finer pitches, then connection density is improved, but the risk of short circuits increases

Engineering Contradiction:

Improveconnector pitch precisionVSAvoidshort circuit risk

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The binding agent serves as an intermediary that physically separates conductive connectors on the chip from conductive elements on the substrate. This isolation allows conductive connectors to be formed with finer pitches for higher connection density while the binding agent prevents short circuits by maintaining electrical isolation, even when pitch distances are reduced.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of conductive connectors with finer pitches, reducing the risk of short circuits and lowering manufacturing costs by creating a buffering space around the connectors and simplifying the bonding process, thus facilitating efficient three-dimensional integration of integrated circuit devices.

Implementation Method 1

a first photosensitive adhesive layer on the integrated circuit device; pressing a second integrated circuit device to the first photosensitive adhesive layer

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS11929345B2Semiconductor device including binding agent adhering an integrated circuit device to an interposer

Publication Date: 2024.03.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a device includes: a first device including: an integrated circuit device having a first connector; a first photosensitive adhesive layer on the integrated circuit device; and a first conductive layer on the first connector, the first photosensitive adhesive layer surrounding the first conductive layer; a second device including: an interposer having a second connector; a second photosensitive adhesive layer on the interposer, the second photosensitive adhesive layer physically connected to the first photosensitive adhesive layer; and a second conductive layer on the second connector, the second photosensitive adhesive layer surrounding the second conductive layer; and a conductive connector bonding the first and second conductive layers, the conductive connector surrounded by an air gap.