Interposer Antenna Structure for Space-Limited Flexible Displays
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Solution Overview
Problem
Electronic devices with flexible displays face challenges in securing a sufficient area for antenna placement, leading to potential antenna performance degradation due to limited space and increased line loss in rollable or slidable designs.
Innovation Solution
The implementation of a printed board assembly (PBA) that includes a first PCB, a second PCB with a conductive area, and an interposer surrounding the space between the two PCBs. The interposer features a first partition wall structure for shielding electronic components and a second partition wall structure with a conductive via to connect the PCBs, allowing the wireless communication circuit to transmit and receive signals by powering the conductive area of the second PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a flexible display is used to provide large screens and portability, then the display area can be varied, but the area available for antenna arrangement is reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked structure by introducing multiple PCB layers separated by an interposer. The antenna is formed using conductive patterns on different PCB layers, utilizing the vertical dimension to create antenna elements without occupying additional horizontal space that would conflict with the flexible display area.
Solution Approach 2:
The antenna structure is nested within the stacked PCB assembly. The conductive patterns on different PCB layers are positioned to overlap or align, creating a nested configuration where antenna elements are embedded within the multi-layer board structure rather than occupying separate external space.
2Volume of moving object
If the antenna connecting structure is made longer in rollable or slidable devices, then the device can be compact when rolled, but line loss increases and antenna radiation performance degrades
Solution Approach 1:
The patent merges the antenna element and the PCB structure into a single integrated assembly. The conductive patterns on the PCB layers serve dual purposes as both structural elements of the board and radiating elements of the antenna, eliminating the need for separate RF cables and connectors that would introduce additional line loss.
Solution Approach 2:
The interposer acts as an intermediary structure that provides electromagnetic shielding between different PCB layers. This shielding reduces signal interference and loss between the antenna elements on different layers, maintaining signal integrity without requiring longer external cable connections.
3Area of stationary object
If multiple stacked PCBs are used to secure component arrangement space, then component arrangement space is increased, but the structure becomes more complex
Solution Approach 1:
The interposer serves multiple functions simultaneously: it provides physical separation between PCB layers, establishes electrical connections between layers through conductive vias, provides electromagnetic shielding, and supports the antenna structure. This multi-functionality reduces the need for additional separate components, thereby simplifying the overall assembly despite the stacked configuration.
Solution Approach 2:
The patent segments the antenna structure into multiple conductive patterns distributed across different PCB layers, with each layer contributing specific antenna elements. This segmentation allows the antenna to be formed using the existing PCB stack-up without requiring a single complex monolithic structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances space availability for electronic devices by utilizing a stacked PCB structure, reduces line loss by eliminating the need for separate RF cables, and improves antenna radiation efficiency and pattern.
Implementation Method 1
the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB
Implementation Method 2
the first partition wall structure configured to provide shielding for at least one electronic component disposed on the PBA
Implementation Method 3
the wireless communication circuit is configured to transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via
Data Source
AI summary
A printed board assembly (PBA) is provided. The PBA includes first printed circuit board (PCB), a second PCB disposed parallel to the first PCB and including a conductive area, a first interposer surrounding a space between the first PCB and the second PCB, and a wireless communication circuit, wherein the interposer may include a first partition wall structure configured to provide shielding for at least one electronic component disposed in the PBA, and a second partition wall structure connected to the first partition wall structure and including an dielectric material, the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit may transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via.