Interposer Array Manufacturing for Uniform Height and EMI Shielding
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Solution Overview
Problem
The manufacturing of different types of interposers requires separate processes, leading to increased costs and thickness dispersion issues in electronic devices, as they often have varying heights and sizes.
Innovation Solution
A method to manufacture interposers of varying sizes and shapes through a single process, using an array substrate with bridges to connect interposers of different sizes, allowing for uniform thickness and reduced production costs by pre-soldering and forming plating layers on specific surfaces to minimize electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different types of interposers are manufactured through separate manufacturing processes, then each interposer type can be customized for specific functions, but the manufacturing cost increases and production efficiency decreases
Solution Approach 1:
The interposer is divided into a body portion and a bridge portion that can be separately formed. The body portion is created through a first photolithography process, and the bridge portion is created through a second photolithography process, allowing different interposer types to be manufactured through a unified process flow while maintaining customization capability
Solution Approach 2:
A single manufacturing process is designed that can produce multiple types of interposers (different sizes, shapes, and configurations) by adjusting photolithography patterns. This universal process eliminates the need for separate manufacturing lines for different interposer types, reducing costs and improving efficiency
2Adaptability or versatility
If different types of interposers with varying heights are used between PCBs, then specific functional requirements can be met, but thickness dispersion increases and requires separate accommodation processes
Solution Approach 1:
Different regions of the interposer are given different heights through selective formation processes. The body portion and bridge portion can have different thicknesses, allowing local adaptation to functional requirements while maintaining overall manufacturing consistency through a unified process
3Shape
If interposers of different sizes and shapes are manufactured separately, then specific design requirements can be satisfied, but manufacturing complexity and cost increase
Solution Approach 1:
The interposer body portion is formed first through a first photolithography process, establishing the base geometry. Subsequently, the bridge portion is added through a second photolithography process, allowing complex final shapes to be built from simpler preliminary structures, thereby reducing overall manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the simultaneous production of interposers with uniform height, reducing manufacturing costs and improving thickness dispersion in electronic devices, while minimizing electromagnetic interference and enhancing production efficiency.
Implementation Method 1
forming plating layers on specific surfaces to minimize electromagnetic interference
Data Source
AI summary
An interposer array is provided, which includes an array substrate, a first interposer configured as a closed curve having a first space therein, a second interposer configured as a closed curve having a second space therein, a plurality of first bridges configured to connect the array substrate and the first interposer, and a plurality of second bridges configured to connect the first interposer and the second interposer.