Interposer Substrate Auxiliary Pads Circuit Board Mounting Stability
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Solution Overview
Problem
The existing structures for connecting circuit boards through interposer substrates often result in reduced mounting space and wiring space, especially when large interposer substrates are used, leading to instability and potential mounting failures due to the need for elongated or asymmetric shapes.
Innovation Solution
The use of an interposer substrate with a signal line, input/output pads, and auxiliary pads disposed at equal intervals, which allows for stable and efficient mounting of circuit boards by reducing the occupation area and increasing bonding strength, while also incorporating an insulating base material layer with a lower effective relative dielectric constant for reduced capacitance and increased flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large interposer substrate is used to connect circuit boards, then the electrical connection between circuit boards is improved, but the mounting space for components on the circuit boards is reduced
Solution Approach 1:
The interposer substrate is divided into multiple smaller interposer substrates, each connecting adjacent circuit boards. This segmentation reduces the area occupied by interposer substrates while maintaining electrical connection functionality between circuit boards.
Solution Approach 2:
The circuit boards are designed with both signal transmission functionality and support functionality for other circuit boards. This multi-functionality allows circuit boards to serve dual purposes, reducing the need for additional support structures and preserving mounting space.
2Area of stationary object
If multiple small interposer substrates are provided to reduce space occupation, then the mounting space is improved, but the wiring space is reduced due to the need for additional wiring connections
Solution Approach 1:
The support function and electrical connection function are merged into a single integrated solution where circuit boards directly support other circuit boards while providing electrical connections. This eliminates the need for separate wiring infrastructure.
Solution Approach 2:
Circuit boards are designed to perform multiple functions simultaneously: signal transmission, power distribution, and mechanical support. This multi-functionality reduces the need for dedicated wiring and support structures, simplifying the overall wiring complexity.
3Strength
If an elongated or asymmetric interposer substrate shape is used to support large circuit boards, then the support capability is improved, but the mounting stability is reduced due to unstable soldering
Solution Approach 1:
Circuit boards are designed with asymmetric arrangements of mounting portions and recesses that complement each other. The support circuit board has mounting portions positioned to align with recesses on the supported circuit board, creating stable mechanical and electrical connections without requiring elongated or asymmetric interposer substrates.
Solution Approach 2:
Instead of using an asymmetric interposer substrate to provide support, the invention inverts the approach by making the circuit boards themselves asymmetric in their support interfaces. The support circuit board provides structural asymmetry through its mounting portions, eliminating the need for asymmetric interposer substrates and their associated soldering stability issues.
Data Source
AI summary
An electronic device includes first and second circuit boards and an interposer substrate. The first principal surface of the interposer substrate faces the first circuit board, and the second principal surface of the interposer substrate faces the second circuit board. A first input/output pad and a first auxiliary pad are provided on the first principal surface of the interposer substrate, and a second input/output pad and a second auxiliary pad portion are provided on the second principal surface of the interposer substrate. The first circuit board includes a land that is connected to the first input/output pad and the first auxiliary pad, and the second circuit board includes a land that is connected to the second input/output pad and the second auxiliary pad portion.