Interposer Beamformer Module for Lower-Cost Multi-Channel Phased Arrays

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Phased array systems for 5G and millimeter wave frequencies require high-performance beamforming, but existing solutions are cost-prohibitive due to the need for many chips, leading to degraded performance and functionality when implemented in low-cost technology nodes.

Innovation Solution

A multi-chip module configuration with interposer passive elements, where high-performance blocks (e.g., low-noise amplifiers) are implemented in high-cost process nodes and digitally-intensive low-performance blocks (e.g., phase shifters, variable gain amplifiers) in low-cost nodes, combined with high-quality passive devices on interposers to achieve multi-channel beamforming.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If phased array systems are implemented using high-cost process nodes to maintain high performance, then beamforming performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improvebeamforming performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The beamforming system is segmented into multiple functional blocks (phase shifters, variable gain amplifiers, low-noise amplifiers, mixers, ADCs) that can be independently implemented in different process nodes. This allows high-performance blocks to use expensive processes while less critical blocks use cheaper processes, resolving the contradiction between performance and manufacturing cost.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different quality levels are applied to different functional blocks based on their performance requirements. Critical blocks like LNAs use high-cost high-performance processes, while less critical blocks like phase shifters and VGAs use low-cost processes. This local differentiation resolves the contradiction by optimizing cost-performance tradeoffs at each location.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If multiple chips are used to achieve multi-channel beamforming functionality, then beamforming capability is improved, but device complexity increases

Engineering Contradiction:

Improvemulti-channel beamforming capabilityVSAvoidnumber of chips

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple functional blocks that would traditionally require separate chips are merged into a single integrated beamforming chip. The chip contains phase shifters, VGAs, LNAs, mixers, and ADCs all on one substrate, reducing the number of discrete chips needed while maintaining multi-channel beamforming capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The beamforming chip is designed as a universal multi-functional platform that can support multiple channels and different beamforming configurations. By integrating diverse functions (RF front-end, beamforming processing, digital control) into a single chip, the system achieves adaptability without proportionally increasing chip count.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240250424A1Multi-chip multi-channel beamformer module with interposer passives

Publication Date: 2024.07.25 SKYWORKS SOLUTIONS INC

AI summary

In some embodiments, a packaged module can include a packaging substrate having a plurality of interposer layers, and an array of transmit and/or receive elements implemented on a respective interposer layer, each transmit/receive element partitioned into a first block configured to provide high-performance functionality, and a second block configured to provide digitally-intensive low-performance functionality, the first and second blocks in combination configured to provide multi-channel beamforming functionality.