Interposer Board Belly-to-Belly Connector Port Density
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Solution Overview
Problem
Current IO connectors in stacked configurations face challenges in achieving higher port density and supporting high data rates, particularly when attempting to stack three ports vertically, as they require thick motherboards or complex routing configurations, which are costly and difficult to implement effectively.
Innovation Solution
A connector system featuring a main board with two stacked connectors in a belly-to-belly arrangement, where one connector is mounted on the main board and the other on an interposer board, with vias and traces providing an electrical connection through double tails, allowing for increased port density without the need for a thicker main board and enabling reuse of existing tooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If three ports are stacked vertically using traditional methods, then port density increases, but motherboard thickness must increase or complex routing configurations are required
Solution Approach 1:
An interposer board is introduced as an intermediary component between the main board and connectors. The interposer board contains through-vias that provide electrical pathways, allowing connectors to be mounted on both sides of the interposer board in a belly-to-belly configuration. This intermediary structure enables high port density without requiring increased motherboard thickness, as the interposer board handles the complex routing internally through its via structure.
2Quantity of substance
If belly-to-belly connector configuration is implemented, then port density increases, but manufacturing complexity and cost increase
Solution Approach 1:
The connector system is segmented into three separate components: the main board, the interposer board, and the connectors. This segmentation allows each component to be manufactured independently using standard processes. The interposer board is manufactured with pre-formed through-vias, and connectors are mounted on both sides of the interposer board using conventional techniques. This segmentation reduces overall manufacturing complexity compared to attempting to integrate all functionality into a single thick motherboard.
3Power
If high data rates up to 25 Gbps are supported, then bandwidth per front face area increases, but circuit board losses increase due to high frequencies
Solution Approach 1:
The electrical connections transition from surface-level traces to three-dimensional vertical pathways through the interposer board's through-vias. This dimensional change allows signals to travel through shorter, more direct vertical paths rather than long horizontal traces on the board surface. The via structure provides controlled impedance pathways that maintain signal integrity at high frequencies, reducing losses associated with traditional planar routing while supporting 25 Gbps data rates.
Data Source
AI summary
A connector system includes a main board and an interposer board. The main board and the interposer board are each configured to mate to a separate connector and are connected together by vias. The vias can provide an electrical path from the interposer board to the main circuit board so that a first connector mounted on the interposer board can be positioned directly in line with a second connector mounted on the main circuit board. The interposer helps make the routing out of signal traces from the two connector simpler while reducing the need for additional layers on the main board. Two connectors can be press-fit mounted to the main board and the interposer board in a belly-to-belly configuration.