Interposer Beyond Reticle Field Conductor Pads
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Solution Overview
Problem
Conventional semiconductor interposers have limited chip size and packing density due to the smaller footprint of the top side reticle field, which restricts the placement of conductor pads and solder bumps, making it difficult to provide adequate electrical interfaces and integration for stacked semiconductor chips.
Innovation Solution
The interposer design includes a first reticle field with active conductor pads and a larger second reticle field with dummy conductor pads outside the first field, allowing for expanded chip placement and increased packing density by utilizing the overhang area for additional metallization structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If photolithography steps are performed using a stepper with a reticle field, then conductor pads can be fabricated within the reticle field, but the footprint is limited and the overhang area is unavailable for conductor pad placement
Solution Approach 1:
The patent extends the usable area from the first reticle field into the overhang region by adding a second reticle field that overlaps with the overhang area. This dimensional extension allows conductor pads to be placed in regions previously unavailable, effectively increasing the functional area without changing the physical interposer size.
Solution Approach 2:
The patent pre-configures the interposer with a second reticle field and dummy conductor pads in the overhang region before chip mounting. This preliminary preparation enables subsequent chip stacking and wire bonding operations to utilize the expanded area, allowing for larger chips and higher packing density without requiring redesign at later stages.
2Ease of manufacture
If the reticle field is kept small for conventional fabrication, then manufacturing processes remain simple, but the interposer cannot support larger chips or higher packing density
Solution Approach 1:
The patent divides the reticle field into two distinct fields: a first reticle field for conventional conductor pad fabrication and a second reticle field extending into the overhang region. This segmentation allows each field to be optimized independently - the first field maintains conventional fabrication simplicity while the second field enables expanded chip placement options.
Solution Approach 2:
The patent applies different functional qualities to different regions: the first reticle field contains active conductor pads for electrical connections, while the second reticle field in the overhang region contains dummy conductor pads that provide structural support and enable chip placement without requiring full electrical connectivity. This local differentiation allows the system to achieve higher packing density while maintaining ease of manufacture in critical regions.
Data Source
AI summary
Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.