Interposer Board 3D Overlap for Semiconductor Signal Transmission
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Solution Overview
Problem
Existing semiconductor devices with contactless signal transmitting/receiving units face challenges in miniaturization and manufacturing due to the elongated shape of silicon interposers, which increases the aspect ratio and complicates handling and alignment, making miniaturization and easy manufacturing difficult.
Innovation Solution
A semiconductor device configuration featuring a base board, first and second elements with contactless signal transmitting/receiving units, and an interposer board with exposed semiconductor material, allowing for contactless signal transmission between elements without conductive members, enabling miniaturization and simplifying manufacturing by reducing the interposer board's aspect ratio and eliminating the need for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the width of the silicon interposer is reduced to enable miniaturization, then the formation region widths of contactless transmitting/receiving units can be reduced, but the aspect ratio of the silicon interposer increases making it elongated and difficult to handle
Solution Approach 1:
The patent changes the orientation of the interposer board from a planar layout to an overlapping three-dimensional configuration. The first and second interposer boards are positioned at different heights (depth direction) and overlap each other, allowing signal transmission without requiring a large planar area. This dimensional transition enables miniaturization while avoiding elongated shapes.
2Area of moving object
If the width of the silicon interposer is reduced to enable miniaturization, then the formation region widths of contactless transmitting/receiving units can be reduced, but the aspect ratio of the silicon interposer increases making manufacturing yield low
Solution Approach 1:
By transitioning to a three-dimensional overlapping configuration, the patent avoids creating elongated interposer boards with high aspect ratios. The interposer boards maintain compact dimensions in all directions, improving manufacturing yield while achieving miniaturization of the overall device.
3Adaptability or versatility
If the interposer is provided with couplers and terminals for contactless signal transmission, then signal transmission capability is achieved, but the structure becomes complicated and high-precision alignment is required
Solution Approach 1:
The patent extracts the contactless signal transmission function from complex coupler-terminal structures and implements it through simpler inductor elements formed on the interposer boards. This extraction simplifies the overall structure while maintaining signal transmission capability between the first and second elements.
Solution Approach 2:
The interposer boards serve multiple functions: they provide mechanical support, enable electrical connections through inductors, and facilitate contactless signal transmission. This multi-functionality eliminates the need for separate dedicated coupler structures, reducing overall device complexity.
4Adaptability or versatility
If the interposer is provided with couplers and terminals for contactless signal transmission, then signal transmission capability is achieved, but high-precision alignment is required during assembly
Solution Approach 1:
By extracting the signal transmission function to simple inductor elements on the interposer boards, the patent eliminates the need for complex alignment between couplers and terminals. The inductors can be positioned more flexibly, reducing alignment precision requirements during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration enables miniaturization of the semiconductor device and simplifies manufacturing by allowing the interposer board to be disposed without increasing its aspect ratio, facilitating easy signal transmission and reducing manufacturing complexity.
Implementation Method 1
an interposer board with an interposer board-first principal surface that has an interposer board-first contactless signal transmitting/receiving unit provided on the interposer board-first principal surface and an interposer board-second contactless signal transmitting/receiving unit provided on the interposer board-first principal surface
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3B
AI summary
A semiconductor device equipped with a base board 10, a first element 20, a second element 30, and an interposer board 40, wherein: the first element 20 is positioned on the base board 10; a signal transmitting/receiving terminal 24 of the first element and a plurality of base board terminals 13 contact one another and are capable of transmitting and receiving a signal; the second element 30 is positioned on the base board 10; a signal transmitting/receiving terminal 34 of the second element and the plurality of base board terminals 13 contact one another and are capable of transmitting and receiving a signal; the interposer board 40 is positioned so as to extend on the first element 20 and the second element 30; a first contactless signal transmitting/receiving unit 43 of the interposer board is capable of contactlessly transmitting and receiving a signal to and from a contactless signal transmitting/receiving unit 25 of the first element via a first element board; and a second contactless signal transmitting/receiving unit 44 of the interposer board is capable of contactlessly transmitting and receiving a signal to and from a contactless signal transmitting/receiving unit 35 of the second element via a second element board 31.