Interposer Package Insulation for Vacuum-Mount Bump Protection
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Solution Overview
Problem
Existing semiconductor packages face challenges during the manufacturing process, particularly when moving bridge structures or surface mount devices (SMDs) using vacuum bumps, which can lead to short-circuiting, bumps coming off, or defects due to stress and misalignment.
Innovation Solution
The proposed solution involves covering portions of the side surfaces of connection members on a device die in an interposer with an insulating member and a molding material, thereby protecting the connection members and preventing issues during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vacuum is applied to move bridge structures or SMDs using bumps, then mounting precision is improved, but bumps may short-circuit, come off, or defect due to stress and misalignment
Solution Approach 1:
The patent applies preliminary action by forming an insulating member around the bumps before the vacuum mounting process. This insulating member pre-provides protection against short-circuiting and mechanical stress during the subsequent vacuum application, preventing defects before they occur.
Solution Approach 2:
The insulating member acts as an intermediary between the bump and the external environment (vacuum pressure, handling equipment). It mediates the stress and forces applied during mounting, protecting the bump from direct mechanical stress while still allowing the vacuum to function for positioning.
2Ease of manufacture
If connection members are exposed during manufacturing, then ease of assembly is improved, but short-circuiting and defects occur
Solution Approach 1:
The insulating member provides local quality by selectively insulating only the critical bump regions that require protection, while leaving other areas of the connection members accessible for assembly operations. This localized insulation approach maintains ease of manufacture while preventing short-circuiting at vulnerable points.
Solution Approach 2:
The insulating member serves as an intermediary protective layer that allows assembly operations to proceed while simultaneously blocking harmful electrical contact. It enables the connection members to remain accessible for assembly while preventing short-circuiting during the manufacturing process.
3Force
If bumps are stressed during vacuum mounting, then mounting force is improved, but bumps may come off or defect
Solution Approach 1:
The insulating member provides beforehand cushioning by being formed around the bumps prior to the vacuum mounting process. This pre-established protective layer cushions the bumps against mechanical stress and forces applied during mounting, preventing bump detachment or defects while still allowing sufficient mounting force to be applied.
Data Source
AI summary
An interposer is provided. The interposer includes a first redistribution structure; a device die on the first redistribution structure, the device die having a first surface facing the first redistribution structure and a second surface which is opposite to the first surface; a plurality of first connection members on the second surface of the device die; an insulating member disposed on the second surface of the device die and covering first portions of side surfaces of the plurality of first connection members; a plurality of second connection members on the first redistribution structure; a molding material disposed on the first redistribution structure and covering each of the device die, second portions of the side surfaces of the plurality of first connection members, the insulating member, and the plurality of second connection members; and a second redistribution structure on the molding material.