Interposer Capping Structure for Semiconductor Package Warpage

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Solution Overview

Problem

Semiconductor packages face warpage issues due to differences in coefficients of thermal expansion between various materials and components, which existing technologies have not effectively addressed.

Innovation Solution

The semiconductor package design includes a package substrate, interposer, semiconductor devices, a molding member with specific molding portions, and a capping structure that covers the molding member and interposer, providing thermal expansion matching and heat dissipation to suppress warpage across a range of temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple semiconductor chips are incorporated within a single semiconductor package using system-in-package techniques, then device performance and integration are improved, but warpage occurs due to differences in coefficients of thermal expansion between different materials and components

Engineering Contradiction:

Improvedevice integrationVSAvoidpackage warpage

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The patent applies thermal expansion principles by selecting materials with matched coefficients of thermal expansion for the capping structure and package substrate. This material selection strategy ensures that both components expand and contract at similar rates during temperature cycling, thereby minimizing differential thermal stress and preventing warpage in the integrated semiconductor package

Inventive Principle:

Principle #37Thermal expansion

Solution Approach 2:

The patent employs composite material strategies by combining multiple materials with complementary properties in the package structure. Specifically, it uses a capping structure made from materials designed to match the thermal expansion characteristics of the package substrate, creating a composite system that maintains dimensional stability across temperature ranges while supporting high device integration

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If a capping structure is added to cover the molding member and interposer, then warpage suppression is improved through thermal expansion matching, but device complexity increases

Engineering Contradiction:

Improvewarpage suppressionVSAvoidpackage structure

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The capping structure is designed to perform multiple functions simultaneously: it provides warpage suppression through thermal expansion matching, protects the underlying molding member and interposer, and contributes to heat dissipation. By consolidating these functions into a single component, the patent achieves effective warpage control without proportionally increasing device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent controls warpage by carefully selecting and adjusting material parameters, specifically the coefficient of thermal expansion, for the capping structure. By modifying this physical parameter to match the package substrate, the design achieves dimensional stability across temperature variations while maintaining a relatively simple overall package structure

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly reduces warpage in semiconductor packages by matching thermal expansion coefficients and effectively dissipating heat, ensuring stability and performance across temperature variations.

Implementation Method 1

differences in coefficients of thermal expansion between different materials and/or components

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

effectively dissipating heat, ensuring stability and performance across temperature variations

Methodology Applied

Scientific EffectHeat dissipation: Convection

Data Source

PatentUS11881456B2Semiconductor package including an interposer disposed on a package substrate and a capping structure disposed on the interposer

Publication Date: 2024.01.23 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes; an interposer mounted on a package substrate, a first semiconductor device and a second semiconductor device mounted on the interposer, a molding member including an outer side wall portion covering an outer side surface of the first semiconductor device, and a lower portion covering at least a portion of an upper surface of the interposer, and a capping structure including an outer side wall portion covering the outer side wall portion of the molding member.