Semiconductor Package Structure With Vertical Die Heat Path
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Solution Overview
Problem
Existing semiconductor package structures face inefficiencies in thermal dissipation, leading to potential damage from increased temperatures and affecting performance.
Innovation Solution
The semiconductor package structure includes a substrate, semiconductor die, interposer, heat spreader, and adhesive layer, with the heat spreader embedded in the interposer to vertically overlap the semiconductor die, and a conductive structure partially disposed in the interposer to electrically couple the substrate, enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation path is lengthened in conventional package structures, then thermal management becomes more difficult, but structural simplicity is maintained
Solution Approach 1:
The heat spreader is embedded within the interposer structure, with the adhesive layer positioned in the cavity of the interposer. This nesting arrangement allows the heat dissipation components to be integrated within the existing package layers, shortening the thermal path without adding external complexity to the overall package structure.
Solution Approach 2:
The heat spreader is positioned to vertically overlap the semiconductor die, creating a direct vertical thermal conduction path through the adhesive layer. This vertical arrangement in the Z-dimension provides a shorter heat dissipation path compared to conventional lateral heat transfer routes, improving thermal efficiency without increasing planar footprint.
2Strength
If adhesive layer thickness is increased to improve bonding, then mechanical strength improves, but thermal conduction efficiency decreases
Solution Approach 1:
The adhesive layer is positioned within the cavity of the interposer, allowing precise control of its thickness. This parameter optimization enables the adhesive layer to provide sufficient bonding strength while maintaining minimal thickness to preserve thermal conduction efficiency, resolving the trade-off between mechanical strength and thermal performance.
3Stability of the object's composition
If interposer thickness is increased to provide structural support, then warpage resistance improves, but manufacturing complexity increases
Solution Approach 1:
The interposer features a cavity structure that is localized to specific regions, providing enhanced structural support and warpage resistance only where needed. This localized approach maintains overall manufacturing simplicity while achieving the required structural stability in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal dissipation efficiency, reduces warpage, and enhances the overall performance of the semiconductor package by shortening the heat dissipation path and providing stronger support.
Implementation Method 1
The adhesive layer is disposed in the cavity and connects the semiconductor die to the heat spreader
Implementation Method 2
The heat spreader is embedded in the interposer and vertically overlaps the semiconductor die
Data Source
AI summary
A semiconductor package structure includes a substrate, a semiconductor die, an interposer, a heat spreader, and an adhesive layer. The semiconductor die is disposed over the substrate. The interposer is disposed over the semiconductor die and has a cavity. The heat spreader is embedded in the interposer and vertically overlaps the semiconductor die. The adhesive layer is disposed in the cavity and connects the semiconductor die to the heat spreader.