Interposer Cavity for Photonic Integrated Circuit Optical Coupling

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Solution Overview

Problem

The increasing demand for higher bandwidth and power efficiency in photonic integrated circuits (PICs) is hindered by yield and handling challenges in packaging and system integration, particularly due to issues with optical coupling and warpage/stress impacts on PICs during assembly.

Innovation Solution

A PIC is placed within an open cavity of an interposer, which can be made of silicon or glass, with an integrated light source or external light source, allowing for improved optical coupling and reduced warpage/stress through the use of waveguides and couplers, enhancing system architecture compatibility and yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a PIC is packaged using conventional methods, then the packaging process can be completed, but yield is reduced due to attachment failures and handling challenges

Engineering Contradiction:

Improvepackaging yieldVSAvoidattachment reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The packaging structure is segmented into distinct functional zones: a cavity region for housing the PIC, a support region for structural integrity, and integrated coupling structures. This segmentation allows the PIC to be isolated in a protected environment while maintaining robust attachment points, thereby improving both yield and attachment reliability simultaneously

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cavity structure and coupling elements are pre-formed in the packaging substrate before PIC insertion. This preliminary preparation ensures proper alignment and reduces handling steps during assembly, minimizing attachment failures and improving packaging yield without compromising reliability

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If optical coupling is improved through precise alignment, then optical performance increases, but manufacturing complexity and handling difficulty increase

Engineering Contradiction:

Improveoptical coupling precisionVSAvoidpackaging structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Integrated coupling structures serve as intermediary elements between the PIC and external optical fibers. These mediators provide mechanical alignment features and optical mode matching, achieving precise optical coupling while simplifying the overall packaging structure by consolidating alignment and coupling functions into single integrated components

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The packaging structure merges mechanical support, optical coupling, and alignment functions into an integrated cavity design. This consolidation achieves precise optical coupling without increasing overall structural complexity, as multiple functions are performed by unified structural elements rather than separate components

Inventive Principle:

Principle #5Merging (Combining)

3Stability of the object's composition

If the PIC is fully enclosed for protection, then environmental stability improves, but optical coupling and heat dissipation are hindered

Engineering Contradiction:

ImprovePIC environmental stabilityVSAvoidoptical coupling efficiency

Core Design Contradiction:

Stability of the object's compositionVSUse of energy by moving object

Solution Approach 1:

The cavity structure implements local quality by providing enclosed protection in regions requiring environmental stability while maintaining open or accessible regions for optical coupling and heat dissipation. This selective enclosure approach ensures PIC stability without compromising optical performance or thermal management

Inventive Principle:

Principle #3Local quality

4Productivity

If multiple PICs are integrated in a single package, then bandwidth increases, but handling and assembly difficulty increase

Engineering Contradiction:

Improvebandwidth capacityVSAvoidassembly ease

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

Each PIC is housed in its own dedicated cavity within the packaging substrate, creating modular segments that can be independently handled and assembled. This segmentation enables parallel processing during manufacturing and simplifies assembly procedures, allowing multiple PICs to be integrated without proportionally increasing assembly difficulty while maintaining high bandwidth capacity

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves optical coupling, reduces waste of good PICs, and enhances system integration by minimizing attachment failures, thereby addressing the power efficiency and bandwidth limitations in high-performance packages.

Implementation Method 1

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20250004223A1Photonic integrated circuit within a cavity of interposer

Publication Date: 2025.01.02 INTEL CORP

AI summary

An apparatus comprising an interposer to couple conductive contacts of a substrate to conductive contacts of an integrated circuit device, wherein the interposer comprises a cavity proximate conductive contacts of the interposer, the conductive contacts of the interposer to couple to conductive contacts of a photonics integrated circuit (PIC).