Interposer Semiconductor Package for Chip Bonding and Heat Dissipation
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Solution Overview
Problem
Current semiconductor packages face challenges in establishing efficient mutual connections between multiple semiconductor chips and achieving effective thermal radiation, which are crucial for smaller, lighter, and multifunctional electronic devices.
Innovation Solution
A semiconductor package design that includes an interposer substrate with a wiring layer, semiconductor chips mounted on it, and redistribution patterns in a passivation layer to facilitate electrical connections between chips and improve thermal dissipation through direct bonding of chip pads to wiring patterns and conductive pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are mounted in a single package, then functionality and integration are improved, but establishing efficient mutual connections between chips becomes difficult
Solution Approach 1:
The patent introduces an interposer substrate as an intermediary component between multiple semiconductor chips. This interposer contains through-electrodes that penetrate through it, providing direct electrical pathways between chips without requiring complex wire bonding or bump connections between each chip pair. The interposer acts as a mediator that simplifies the connection architecture while enabling multifunctional integration.
Solution Approach 2:
The patent transitions from planar chip connections to three-dimensional vertical connections by stacking chips on the interposer substrate. The through-electrodes extend vertically through the interposer, enabling electrical connections in the Z-direction (vertical dimension) rather than only in the XY-plane. This dimensional transition allows efficient inter-chip connectivity in a compact footprint.
2Volume of moving object
If chips are closely stacked to reduce package size, then miniaturization is achieved, but thermal radiation becomes insufficient
Solution Approach 1:
The interposer substrate serves as a thermal intermediary between the stacked chips and the external environment. It incorporates thermal conduction paths and radiation surfaces that extend from the chip mounting region to the package exterior. This mediator structure enables efficient heat extraction from densely stacked chips without increasing the overall package footprint.
Solution Approach 2:
The interposer substrate performs multiple functions simultaneously: it provides electrical interconnection through through-electrodes, mechanical support for chip mounting, and thermal management through integrated conduction and radiation pathways. This multi-functionality allows the same component to address both miniaturization and thermal radiation requirements.
3Manufacturing precision
If direct bonding of chip pads to wiring patterns is implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The interposer substrate is pre-fabricated with through-electrodes and wiring patterns in specific positions before chip mounting. This preliminary preparation establishes precise alignment references that guide the subsequent chip bonding process. The pre-configured electrical pathways eliminate the need for complex post-bonding alignment adjustments, thereby improving manufacturing precision while the modular structure keeps complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy mutual connection between semiconductor chips and enhances thermal radiation properties, allowing for the efficient discharge of heat and operation of multiple chips as a unified system.
Implementation Method 1
Each of the plurality of chip pads may be directly bonded to a corresponding one of a plurality of wiring patterns in the wiring layer
Implementation Method 2
a passivation layer on the first surface of the interposer substrate, the passivation layer covering the semiconductor chip
Data Source
AI summary
Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.