Interposer-Based Semiconductor Package for Dense Chip Stack Routing

The patent transitions from a planar two-dimensional layout to a three-dimensional vertical stacking architecture. Multiple chip stacks are arranged vertically above the substrate rather than horizontally, allowing more chips to be integrated within the same mounting footprint. This dimensional change enables increased storage capacity and improved response speed through shorter signal paths while maintaining or reducing the overall mounting area.

The patent implements a nested hierarchical structure where multiple semiconductor chips are stacked vertically to form chip stacks, which are then connected to buffer chips on the interposer. This nesting arrangement allows multiple functional layers to be integrated within a compact volume, effectively increasing the number of chips per unit area while managing the complexity through organized hierarchical connections.

The patent divides the semiconductor system into distinct functional modules: memory chip stacks, buffer chips, and an interposer with interconnect circuits. Each segment performs a specific function and can be independently designed and manufactured. This segmentation manages device complexity by creating modular units that are easier to design, test, and assemble while achieving high storage capacity through the combination of multiple segments.

The interposer serves multiple functions simultaneously: it provides electrical interconnection between chip stacks and buffer chips, enables signal routing, and facilitates thermal management. The buffer chips also perform multiple roles including data buffering, signal conditioning, and protocol conversion. This multi-functionality reduces the need for additional dedicated components, thereby managing device complexity while achieving high storage capacity.