Interposer Chip Thermal Dissipation in Semiconductor Packages
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Solution Overview
Problem
Current semiconductor packages face challenges in enhancing thermal conductivity and reliability while maintaining a compact design, particularly in high-performance chip stacks where heat management is critical.
Innovation Solution
The use of an interposer chip with a high thermal conductivity, larger footprint than the semiconductor chip, and a redistribution layer to efficiently dissipate heat and facilitate electrical connections through bonding wires and solder balls, along with a molding layer to protect and expose pads for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are extended to second pads spaced apart from first pads on the interposer chip, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent divides the electrical connection path into multiple segments: first pads on the semiconductor chip, bonding wires, second pads on the interposer chip, and redistribution layers. This segmentation allows each component to be optimized independently while improving overall connection reliability through distributed connection points rather than single-point failures.
Solution Approach 2:
The interposer chip serves as an intermediary component between the semiconductor chip and the external environment. It provides a platform with both first pads (for bonding wire connections to the chip) and second pads (for external connections), acting as a mediator that enables reliable electrical connections while managing the complexity of direct chip-to-external connections.
2Temperature
If the interposer chip has a footprint greater than the semiconductor chip, then thermal dissipation is improved, but area occupied increases
Solution Approach 1:
The interposer chip is designed with non-uniform pad distribution and varying thickness regions. The footprint is larger than the semiconductor chip specifically to provide adequate spacing for second pads and bonding wires, while the actual active connection areas are concentrated in specific regions. This local quality variation optimizes thermal dissipation pathways without uniformly increasing the occupied area.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking the interposer chip above the semiconductor chip rather than placing it side-by-side. This vertical arrangement allows the interposer to have a larger footprint for thermal management purposes without significantly increasing the overall planar footprint of the package, as the expansion occurs in the Z-direction rather than the X-Y plane.
3Adaptability or versatility
If multiple bonding wires are used to connect second pads to the first substrate, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The interposer chip is pre-fabricated with the redistribution layer and second pads formed before the bonding wire attachment process. This preliminary action of creating the pad structure in advance allows for standardized bonding wire attachment procedures, reducing manufacturing complexity compared to forming complex multi-layer trace patterns during assembly.
Solution Approach 2:
The patent replaces complex mechanical routing of multiple bonding wires with a more simplified system where the interposer chip's redistribution layer provides the electrical pathways. The bonding wires serve only as vertical interconnects rather than carrying complex routing functions, substituting the mechanical routing complexity with a layered electrical interconnection system that is easier to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal management, operational reliability, and compactness of semiconductor packages, allowing for easier electrical connections and improved performance in high-performance chip stacks.
Implementation Method 1
The use of an interposer chip with a high thermal conductivity, larger footprint than the semiconductor chip, and a redistribution layer to efficiently dissipate heat
Implementation Method 2
a bonding wire electrically connected to the second pad and the first substrate
Data Source
AI summary
A semiconductor package includes a substrate, a semiconductor chip mounted on the substrate, an interposer chip on the semiconductor chip and including a redistribution pattern, a first pad on the interposer chip, a second pad on the interposer chip and spaced apart from the first pad, and a bonding wire electrically connected to the second pad and the first substrate. The second pad is electrically connected through the redistribution pattern to the first pad. The footprint of the interposer chip is greater than the footprint of the first semiconductor chip.