Interposer With Communicating Hole For Multilayer Capacitor Noise And Cleaning
Solution Overview
Problem
The existing chip-component structures with multilayer capacitors on circuit boards face issues with mechanical distortion causing audible noise and flux residue corrosion, where residues are difficult to clean between the interposer and the circuit board.
Innovation Solution
A chip-component structure with a multilayer capacitor mounted on an interposer featuring a substrate with a communicating portion, such as a hole or groove, that allows air and cleaning agents to flow, facilitating the removal of flux residues and reducing the amount of joining material that reaches the capacitor, thereby reducing noise and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between the multilayer capacitor and the circuit board to reduce mechanical distortion and audible noise, then the noise is reduced, but flux residues become difficult to clean from the space between the interposer and the circuit board
Solution Approach 1:
The interposer substrate is segmented by providing a communicating portion (hole or groove) that divides the space between the interposer and circuit board into accessible regions. This segmentation allows cleaning agents to reach flux residues that would otherwise be trapped in the confined space, solving the cleaning difficulty while maintaining the noise reduction function of the interposer structure.
Solution Approach 2:
The communicating portion acts as an intermediary passage that enables cleaning agents to access the space between the interposer and circuit board. This intermediary structure allows the cleaning process to effectively reach trapped flux residues without compromising the mechanical isolation function of the interposer.
2Reliability
If joining material is applied to mount the interposer on the circuit board, then electrical and mechanical connection is achieved, but flux residues remain around the joining material and corrode peripheral electrodes
Solution Approach 1:
The communicating portion extracts or removes the trapped flux residues from the space between the interposer and circuit board by allowing cleaning agents to access and remove them. This extraction of harmful residues prevents corrosion of peripheral electrodes while maintaining the reliable electrical connection provided by the joining material.
3Device complexity
If the multilayer capacitor is mounted directly on the circuit board, then the structure is simple, but mechanical distortion causes audible sound emission
Solution Approach 1:
The interposer serves as an intermediary substrate between the multilayer capacitor and the circuit board. This intermediary structure absorbs mechanical distortion and prevents it from being transmitted to the circuit board, thereby eliminating audible sound emission while adding only moderate structural complexity.
Data Source
AI summary
A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection electrode, and a side electrode. The component connecting electrode and the external connection electrode are electrically connected by the side electrode. The component connecting electrode is joined to an external electrode of the multilayer capacitor. The substrate includes a communication hole that communicates between opposite spaces opening in both principal surfaces of the substrate.