Interposer Composite Insulating Layers Thermal Stress Management
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Solution Overview
Problem
Existing interposers face challenges in balancing rigidity and thermal stress management due to differences in thermal expansion coefficients between semiconductor elements and interposers, leading to potential warpage and adhesion issues, while also requiring efficient wiring configurations for signal transmission.
Innovation Solution
An interposer design featuring an inorganic insulating layer, a first wiring formed using a damascene method, an organic insulating layer with a thicker second wiring, and a conductor portion connecting both, along with a protective film and support substrate, which enhances rigidity and adhesion, reduces thermal stress, and optimizes wiring resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an inorganic insulating layer is used to provide rigidity, then structural stability is improved, but thermal stress accumulates due to mismatched thermal expansion coefficients
Solution Approach 1:
The patent employs a composite insulating layer structure combining inorganic insulating layers (such as SiO2) and organic insulating layers (such as polyimide). This composite structure balances rigidity and thermal stress management by leveraging the high structural stability of inorganic materials while the organic layers accommodate thermal expansion differences, thereby reducing overall thermal stress in the interposer assembly.
2Reliability
If wiring layers are formed with plating method, then electrical connectivity is achieved, but adhesion issues arise between wiring and insulating layers
Solution Approach 1:
The patent uses composite insulating layers comprising both inorganic and organic materials to improve adhesion between wiring layers and insulating layers. The organic insulating layer serves as an effective adhesion promoter between the inorganic insulating layer and copper wiring layers, preventing adhesion failures while maintaining electrical connectivity through the plating-formed wiring structure.
3Ease of manufacture
If a single-layer insulating structure is used, then manufacturing is simplified, but thermal stress management becomes insufficient
Solution Approach 1:
The patent divides the insulating structure into multiple layers with different material compositions - specifically combining inorganic insulating layers and organic insulating layers. This segmentation allows each layer to perform its specialized function: inorganic layers provide structural rigidity while organic layers manage thermal stress, achieving effective thermal stress management without significantly complicating the manufacturing process.
4Reliability
If wiring resistance is reduced for efficient signal transmission, then signal quality improves, but wiring structure complexity increases
Solution Approach 1:
The patent reduces wiring resistance by optimizing wiring layer parameters including increasing wiring thickness and adjusting wiring patterns. These parameter changes are implemented within the existing multi-layer insulating structure, achieving improved signal transmission quality without requiring fundamental changes to the overall wiring structure or adding excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively manages thermal stress, maintains interposer flatness, ensures reliable adhesion, and reduces wiring resistance, enabling efficient signal transmission and robust interposer performance.
Implementation Method 1
differences in thermal expansion coefficients between semiconductor elements and interposers
Implementation Method 2
a first wiring formed in or on a surface of the inorganic insulating layer, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring
Data Source
AI summary
An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.