Interposer Compression Connectors for Memory Upgradability

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Solution Overview

Problem

The existing memory on package (MOP) architecture has limitations, including non-upgradeable memory, thermal crosstalk between memory and compute dies, and connector alternatives that increase system size, cause signal degradation due to oxidation and electromagnetic interference.

Innovation Solution

A system using an interposer with compression-based connectors that removably connects memory modules to a substrate, reducing pin length, minimizing thermal interference, and eliminating exposed edges, while allowing for modular memory upgrades and improved signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If memory is directly soldered onto the compute substrate, then memory access latency is reduced and system layout is compact, but memory becomes non-removable and cannot be upgraded or replaced

Engineering Contradiction:

Improvememory access latencyVSAvoidmemory upgradability

Core Design Contradiction:

SpeedVSAdaptability or versatility

Solution Approach 1:

The system is divided into three separate components: the compute substrate, the interposer board, and the memory module. This segmentation allows memory to be physically separated from the compute substrate while maintaining high-speed electrical connections, enabling both low latency and upgradability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An interposer board is introduced as an intermediary component between the compute substrate and memory module. The interposer contains compression-based connectors that provide direct electrical pathways, acting as a mediator that maintains low-latency connections while enabling removable memory architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If memory is directly soldered onto the substrate, then thermal crosstalk between memory and compute die occurs, but direct attachment maintains compact form factor

Engineering Contradiction:

Improvethermal crosstalkVSAvoidsystem size

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The memory module is positioned in a different spatial dimension relative to the compute substrate, separated by the interposer board. This dimensional separation physically isolates heat sources while maintaining electrical connectivity, reducing thermal crosstalk without significantly increasing system footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If connector alternatives are used to avoid direct attachment, then memory becomes removable, but pin length increases causing electromagnetic interference and signal degradation

Engineering Contradiction:

Improvememory removabilityVSAvoidelectromagnetic interference

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The connector design changes the physical parameters of the connection path by using compression-based connectors with minimized pin lengths through the interposer board. This parameter optimization reduces electromagnetic interference and signal degradation while maintaining removability.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If traditional connectors are used, then exposed edge contacts are created that can oxidize, but compression-based connectors eliminate exposed edges

Engineering Contradiction:

Improveconnection reliabilityVSAvoidconnector structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The compression-based connectors are designed to make enclosed contact with the memory module edges, eliminating exposed edge contacts that would otherwise oxidize. The connector structure self-encloses the contact points through compression, providing inherent protection against oxidation without additional protective components.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables upgradability, modularity, and reduced thermal crosstalk, while maintaining a compact form factor and minimizing electromagnetic interference, thus enhancing memory performance and system reliability.

Implementation Method 1

the connector pins being compression-based connector pins having a first portion extending past a first surface of the interposer board; and a plate to cover the PCB and secure the PCB and the interposer board to the substrate, the plate to compress the connector pins of the interposer board, including to compress the first portion toward the first surface of the interposer board

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS20230006374A1Memory on package with interposer with compression-based connectors

Publication Date: 2023.01.05 INTEL CORP

AI summary

A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.