Interposer With Concave-Convex Electrodes For Moisture Protection
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Solution Overview
Problem
Conventional silicon capacitors in interposers face issues with moisture absorption during manufacturing, leading to electrical leakage and potential short circuits, and the process of exfoliating support substrates can degrade electrical characteristics.
Innovation Solution
An interposer design featuring a substrate with a concave-convex structure and a dielectric layer sandwiched between two parallel layers, where conductive parts pass through the substrate to connect electrodes, preventing dielectric exposure and eliminating the need for support substrate exfoliation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a trench structure is formed in a silicon substrate to expand capacitor capacitance, then the capacitance increases, but the dielectric absorbs moisture during manufacturing leading to electrical leakage and potential short circuits
Solution Approach 1:
The patent transitions from a planar capacitor structure to a three-dimensional structure by forming protrusions and recesses on the facing surfaces of the substrate layers. This dimensional change increases the electrode surface area and capacitance without requiring deep trenches that would expose the dielectric to moisture during manufacturing processes.
Solution Approach 2:
The capacitor structure is formed with protrusions and recesses before the substrate layers are bonded together. By pre-forming the capacitance-enhancing features and then sealing the dielectric between the substrate layers, the dielectric is protected from moisture absorption during subsequent manufacturing steps, preventing electrical leakage.
2Length of stationary object
If a support substrate is laminated on the interposer and then exfoliated to minimize package height, then the package height is reduced, but solution treatment during exfoliation degrades the electrical characteristics of the capacitor
Solution Approach 1:
The capacitor structure with protrusions and recesses is formed before substrate bonding, allowing the dielectric to be sealed and protected before any support substrate lamination or exfoliation processes. This preliminary formation ensures the capacitor's electrical characteristics are established and protected from subsequent processing steps.
Solution Approach 2:
The invention eliminates the need for a separate support substrate by forming the capacitor structure directly within the substrate layers themselves. The substrate layers serve both as structural support and as the capacitor housing, removing the exfoliation step that would otherwise expose the dielectric to degrading solutions.
3Ease of manufacture
If the dielectric is exposed during manufacturing processes, then the capacitor can be formed and installed, but moisture absorption occurs leading to potential electric shortages between capacitor electrodes
Solution Approach 1:
The substrate layers themselves act as protective shells enclosing the dielectric layer. By forming the capacitor structure with protrusions and recesses before bonding the substrate layers together, the dielectric is sealed between two protective substrate layers, preventing moisture ingress while maintaining manufacturability.
Solution Approach 2:
The dielectric layer is nested between the two substrate layers, with the capacitor electrodes and dielectric structure contained within the protective housing formed by the substrate layers. This nested structure protects the sensitive dielectric from environmental moisture while allowing the capacitor to be formed and installed.
Data Source
AI summary
An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.