Interposer Conductive Wire Encapsulation

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Solution Overview

Problem

The existing manufacturing processes for semiconductor package devices with fan-out structures face challenges in forming conductive pillars taller than 200 micrometers, requiring multiple electroplating processes, increasing costs and time, and introducing reliability issues due to the use of thick photoresist.

Innovation Solution

The use of an interposer with conductive wires encapsulated by a package body, where the conductive wires are electrically isolated by oxide layers and exposed terminals, eliminating the need for electroplating and allowing for the formation of taller interconnection structures without the need for multiple electroplating processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If multiple electroplating processes are used to form conductive pillars taller than 200 micrometers, then the height of conductive pillars is improved, but manufacturing cost and time increase

Engineering Contradiction:

Improveheight of conductive pillarVSAvoidmanufacturing cost and time

Core Design Contradiction:

Length of stationary objectVSEase of manufacture

Solution Approach 1:

The patent replaces the electroplating process with a wire bonding process. Instead of using electroplating to form conductive pillars, the invention uses a conductive wire that is bonded to the substrate and extends through the encapsulant to form the interconnection structure. This substitution eliminates the need for multiple electroplating processes and thick photoresist, thereby reducing manufacturing cost and time while achieving the required height.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Length of stationary object

If thick photoresist is used to form tall conductive pillars, then the height of conductive pillars is improved, but reliability issues are introduced

Engineering Contradiction:

Improveheight of conductive pillarVSAvoidreliability of semiconductor device

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The patent replaces the photoresist-based formation method with a wire bonding method. The conductive wire is directly bonded to the substrate and extends through the encapsulant without requiring thick photoresist layers. This eliminates the reliability issues associated with thick photoresist while achieving the required pillar height.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Length of stationary object

If multiple electroplating processes are used, then the height of conductive pillars is improved, but manufacturing time increases

Engineering Contradiction:

Improveheight of conductive pillarVSAvoidmanufacturing time

Core Design Contradiction:

Length of stationary objectVSLoss of time

Solution Approach 1:

The patent replaces multiple electroplating processes with a single wire bonding operation. The conductive wire is bonded to the substrate and extends through the encapsulant in one process step, eliminating the need for multiple electroplating cycles and intermediate processing steps, thereby significantly reducing manufacturing time.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If conventional electroplating process is used, then conductive pillars can be formed, but manufacturing complexity increases

Engineering Contradiction:

Improveability to form conductive pillarsVSAvoidmanufacturing process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces the complex multi-step electroplating process with a simpler wire bonding process. The conductive wire is directly bonded to the substrate and extends through the encapsulant, eliminating the need for multiple electroplating steps, photoresist application, and other complex processing steps, thereby reducing manufacturing process complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10325854B2Interposer and semiconductor package device

Publication Date: 2019.06.18 ADVANCED SEMICON ENG INC

AI summary

An interposer comprises a first conductive wire having a first terminal and a second terminal, a first oxide layer, and an encapsulant. The first oxide layer covers the first conductive wire and exposes the first terminal and the second terminal of the first conductive wire. The encapsulant covers the first oxide layer and exposes the first terminal and the second terminal of the first conductive wire.